Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1757 SMT / PCB Assembly Related Technical Articles

New Life for Aging Electronic Products

Oct 01, 2008 | Paul Nickelsberg, President and Senior Engineer, Orchid Technologies.

Many Original Equipment Manufacturers, (OEM’s), struggle to continue shipping aging or obsolete electronic products. Electronic products designed five to ten years ago are still relevant in the marketplace. Often these venerable old products have gained particular acceptance amongst a select group of customers. In many cases these old products fulfill a need in a unique manner. Examples include: designs that are grandfathered into an application due to regulatory considerations; designs having unique form-fit-and-function; designs running special software ; designs subject to contractual support and service requirements; designs in which a new contract stipulates delivery of older gear as part of a larger system offering. Any one or all of these reasons can lead an OEM to continue the production of electronic equipment well into its end of useful component life...

Publisher: Orchid Technologies Engineering & Consulting, Inc.

Orchid Technologies Engineering & Consulting, Inc.

Orchid develops custom electronic products for OEM's.

Maynard, Massachusetts, USA

Consultant / Service Provider, Manufacturer

Facedown Low-Inductance Solder Pad and Via Schemes

Sep 04, 2008 | John Prymak, Erik Reed, Allen Mayar

In the quest for lower ESL devices, having the ESL reduced in the package is only half of the battle; connecting that device to the circuit determines how much of that low ESL appears to the circuit. For this low ESL part type, it would be a shame to take a part of 200 pH and add 2000 pH to its ESL because of via patterns on the PCB....

Publisher: KEMET Electronics Corporation

KEMET Electronics Corporation

KEMET offers the world's most complete line of surface-mount and through-hole capacitor technologies across tantalum, ceramic, film, aluminum, electrolytic, and paper dielectrics.

Simpsonville,

Manufacturer

Effect of Contact Time on Lead-Free Wave Soldering

Aug 28, 2008 | Jim Morris, Richard Szymanowski

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics of the solder wave for adequate hole fill is an essential step in achieving a reliable process. A variety of solder waves exist in the industry; each with advantages and disadvantages when performing lead-free wave soldering. One way to ensure adequate hole-fill is by increasing contact time at the Chip Wave....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Manufacturer

Lean Kitting: A Case Study

Aug 20, 2008 | Ranko Vujosevic, Ph.D. Optimal Electronics Corporation Jose A. Ramirez, Larry Hausman-Cohen, and Srinivasan Venkataraman The University of Texas at Austin Department of Mechanical Engineering Austin, Texas

Kitting is the first step in printed circuit board assembly. It is initiated well in advance of the actual production start to be able to prepare and deliver the kit on time. Kitting involves the gathering of all the parts needed for a particular assembly from the stockroom and issuing the kit to the manufacturing line at the right time and in the right quantity. This paper discusses kitting, describes ways to eliminate waste in different phases of kitting, and illustrates lean kitting using a case study conducted in a major contract manufacturer site....

Publisher: Optimal Electronics Corporation

Optimal Electronics Corporation

A global provider of innovative manufacturing execution system (MES) solutions for the electronics assembly industry.

Austin, Texas, USA

Consultant / Service Provider

XRF- A Reality Check

Aug 14, 2008 | Sia Afshari

The Restriction of Hazardous Substances (RoHS) regulations of the European Union, and similar regulations being enacted around the world, require the virtual elimination of lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr6), polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE) from electronic products. Allowable concentration levels in any homogeneous material contained within a product are extremely low: 0.01% for Cd and 0.1% for other substances by weight. The most significant issue affecting the practical validation of RoHS compliance in the day-to-day assembly environment is ensuring that no restricted substances, especially tin-lead (SnPb) materials, have inadvertently entered into the production stream....

Publisher: RMD Instruments

RMD Instruments

Since 1974 RMD has been providing innovative solutions across a broad range of security, medical and industrial applications, including radiation imaging and detection, nuclear instrumentation and non-destructive test equipment.

Watertown, Massachusetts, USA

Manufacturer

Selection Of Wave Soldering Fluxes For Lead-Free Assembly

Jul 10, 2008 | Chrys Shea, Sanju Arora, Steve Brown

This paper reviews the J-STD-004 and how it is used in flux categorization and selection. It also discusses the major types of flux formulations available, and the design, process and reliability implications of using each type. The purpose of the paper is to help the reader make an informed choice when selecting wave solder fluxes for lead-free processing....

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Lakeville, Minnesota, USA

Manufacturer

Lead-Free Reliability - Building It Right The First Time

Jul 01, 2008 | Peter Biocca

As lead-free and RoHS compliancy fast approaches, it is more important than ever to build it right the first time. Lead-free assembly and RoHS will bring about numerous changes and the number of variables with which to contend is increasing, creating increased risk of defects and reduced product reliability. However, understanding what the variables are and their impact on the assembly can great increase product reliability....

Publisher: Kester

Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer

Printable Nanocomposites for Electronic Packaging

Jun 25, 2008 | Endicott Interconnect Technologies, Inc.

Printing technologies provide a simple solution to build electronic circuits on o low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technology. Advanced printing is relatively new technology and need more characterization and optimization for practical applications. In the present paper, we examine the use of nanocomposites or materials in the area of printing technology....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer

Enterprise-wide Supplier Quality Management: The Big Payoff for Global SPC

Jun 04, 2008 | Zontec Inc.

The convergence of a wide range of global influences is having a profound effect on current-day quality in manufacturing. Today's operational strategies must take into account business cycles, risk-based management, logistics, workflows, outsourcing, regulatory issues, product development, corporate mergers and acquisitions. In this ever-changing economy it is imperative that companies compete more effectively on two fronts: by reducing costs and emphasizing quality....

Publisher: Zontec, Inc.

Zontec, Inc.

SPC software manufacturer. Our software includes such extras as defect tracking, traceability, trend and root cause analysis, overall equipment effectiveness (OEE), rolled throughput yield (RTY), equipment uptime/downtime and supplier quality management in a true real-time production-based system.

Cincinnati, Ohio, USA

Consultant / Service Provider

Solder Paste Inspection Technologies: 2D-3D Correlation

May 28, 2008 | Rita Mohanty, Vatsal Shah; Speedline Technologies, Paul Haugen, Laura Holte; Cyber Optics Corp.

This paper describes correlation between a true 2D area measurement (e.g. printer) and a height map generated area from a SPI system. In addition, this paper will explore the correlation between area/volume measurements and bridge detection between 2D/3D techniques. The ultimate goal is to arm the process engineers with information that can be used to make decision that will impact defects, cost, throughput and Return On Investment....

Publisher: Speedline Technologies, Inc.

Speedline Technologies, Inc.

Speedline Technologies serves the electronics assembly and semiconductor packaging industries with class-leading equipment, responsive support and unparalleled process knowledge.

Franklin, Massachusetts, USA

Manufacturer

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