Electronics Manufacturing Technical Articles

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823 SMT / PCB Technical Articles

Practical Fiber Weave Effect Modeling

Published:	Mar 16, 2011
Author:	Lambert Simonovich
Abstract:	Fiber weave effect is becoming more of an issue as bit rates continue to sore upwards to 5GB/s and beyond. Due to the non-homogenous nature of printed circuit board laminates, the fiberglass weave pattern causes signals to propagate at different speeds wi...
Publisher:	Lamsim Enterprises Inc.

Lamsim Enterprises Inc.

Stittsville, Ontario, Canada

category: Consultant

Specialists in high speed serial link architectures by providing innovative signal integrity & backplane solutions

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

Published:	Mar 10, 2011
Author:	Neil Poole, Ph.D. and Brian Toleno, Ph.D.
Abstract:	History shows that the electronics assembly industry is always up for a good challenge. This was proven with the successful move from through-hole to SMT assembly, the elimination of CFCs from the cleaning process and implementation of lead...
Publisher:	Henkel Corporation

Henkel Corporation

Irvine, California, United States

categories: Manufacturer of Assembled PCBs, Other, Assembly

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal pahse change pads.

A New (Better) Approach to Tin Whisker Mitigation

Published:	Mar 03, 2011
Author:	Craig Hillman, Gregg Kittlesen, and Randy Schueller
Abstract:	Most of the electronics industry by now knows about tin whiskers. They know whiskers are slim metallic filaments that emanate from the surface of tin platings. They know these filaments are conductive and can cause shorts across adjacent conductors....
Publisher:	DfR Solutions

DfR Solutions

College Park, Maryland, United States

category: Service Provider

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

Dross and the Selective Soldering Process

Published:	Feb 24, 2011
Author:	Alan Cable
Abstract:	In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction with the presence of Oxygen in two different areas of the process, and by separate means. Each must ...
Publisher:	ACE Production Technologies

ACE Production Technologies

Spokane Valley, Washington, United States

category: Soldering

Manufacturer of Selective Soldering Machines, Lead Tinning Machines and related products.

Ground Pours - To Pour Or Not To Pour?

Published:	Feb 17, 2011
Author:	Barry Olney
Abstract:	Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas < 2.5.mm square are deleted automatically by t...
Publisher:	In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd

Bundall, Australia

category: Service Provider

In-Circuit Design provides PCB Design and EDA software training at the public, private and tertiary levels.

Novel Transmission Line for 40 GHz PCB Applications

Published:	Feb 10, 2011
Author:	Jamal S. Izadian, Ph.D. - RFCONNEXT, Inc., Julian Ferry, Justin McAllister - Samtec, Inc.
Abstract:	In this paper, we discuss an electromagnetics based approach to transmission line design, and then explore a novel printed transmission line, Periodic Micro Transmission Line (PMTL™, Patents Pending), with improved signal integrity to 40 GHz....
Publisher:	Samtec, Inc.

Samtec, Inc.

New Albany, Indiana, United States

category: Subcontractor

Samtec is recognized as the service leader in the connector industry. Most Samtec products fall into one of three categories: high speed (signal integrity), micro pitch, and rugged/power products.

0201 and 01005 Adoption in Industry

Published:	Feb 03, 2011
Author:	DfR Solutions
Abstract:	First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts for approximately 20% of surface mounted component (SMC) demand worldwide1. This pu...
Publisher:	DfR Solutions

DfR Solutions

College Park, Maryland, United States

category: Service Provider

Dispelling 10 Myths About Nitrogen Reflow

Published:	Jan 27, 2011
Author:	Dr. Andy Mackie
Abstract:	In this paper, we will talk about reflow in an enclosed oven, although many of these discussions may pertain to wave soldering and even vacuum soldering.....
Publisher:	Indium Corporation of America

Indium Corporation of America

Utica, New York, United States

categories: Manufacturer of Assembly Material, Soldering

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Development of Ultra-Multilayer Printed Circuit Board

Published:	Jan 20, 2011
Author:	Yasuyuki Shinbo
Abstract:	This article introduces the technical development that went in to realizing an 80-layer ultra-multilayer printed circuit board, which meets the market demand for a "semiconductor test board supporting memory increases"....
Publisher:	OKI Printed Circuits Co., Ltd.

OKI Printed Circuits Co., Ltd.

Tokyo, Japan

category: Contract Manufacturer

OKI Printed Circuits is engaged in design, manufacturing and sales of high-end multi-layer printed circuit boards.

PCB Stack-Up

Published:	Jan 20, 2011
Author:	Henry Ott Consultants
Abstract:	PCB stack-up is an important factor in determining the EMC performance of a product. A good stack-up can be very effective in reducing radiation from the loops on the PCB (differential-mode emission), as well as the cables attached to the board (common-mo...
Publisher:	Henry Ott Consultants