Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1757 SMT / PCB Assembly Related Technical Articles

Nanofluids, Nanogels and Nanopastes for Electronic Packaging

Dec 22, 2010 | Rabindra N. Das, Varaprasad Calmidi, Mark D. Poliks and Voya R. Markovich

This paper discusses polymer based nanogels, nanofluids and nanopastes for thermal interface material (TIM) applications. Nanopaste and nanogel formulated using controlled-sized particles to fill small bond lines is highlighted....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer

Heat Management in Printed Circuit Boards

Dec 16, 2010 | Jakob Dieterle

This report discusses the significance of heat management in the design of printed circuit boards (PCB). After an introduction into the basics of PCBs the crucial mechanisms of heat transfer are discussed with regard to significance and typical design par...

Publisher: Lund University, The Faculty of Engineering

Lund University, The Faculty of Engineering

The Faculty of Engineering at Lund University is among the leading engineering faculties in Europe, with more than 7000 undergraduates and 800 postgraduates.

Lund, Sweden

Research Institute / Laboratory / School

3D ICs With TSVs - Design Challenges And Requirements

Dec 09, 2010 | Cadence

As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up – to 3D ICs with through-silicon vias (TSVs). 3D ICs promise “more than Moore” integration by packing a great deal of functionality int...

Publisher: Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

World's leading EDA company.

San Jose, California, USA

Consultant / Service Provider

Multilayer PCB Stackup Planning

Dec 02, 2010 | Barry Olney

Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate ca effectively reduce electromagnetic emissions, crosstalk and also make the...

Publisher: In-Circuit Design Pty Ltd

In-Circuit Design Pty Ltd

In-Circuit Design provides PCB Design and EDA software training at the public, private and tertiary levels.

Bundall, Australia

Consultant / Service Provider

Component Shortages Causing Electronics Manufacturers to "Use All Means Necessary" to Ship Products

Nov 24, 2010 | Bob Wettermann

As the electronics manufacturing and assembly industry in the US recovers to some degree from the economic crisis which began in 2008, the challenge of component shortages has risen to the top as one of the stumbling blocks for contract assemblers and cap...

Publisher: BEST Inc.

BEST Inc.

BEST offers professional rework, repair and prototype builds of PCBs. Our expertise is on BGA rework and QFN rework. Our experienced instructors teach professional soldering classes as we are an IPC certified training center

Rolling Meadows, Illinois, USA

Consultant / Service Provider, Manufacturer

A High Performance and Cost Effective Molded Array Package Substrate

Nov 18, 2010 | Philip Rogren, Pierangelo Magni, Maura Mazzola, Mark Shaw, Giovanni Graziosi, Claudio Maria Villa

In this article we present both a relatively new and innovative family of packages that is suitable for medium pin count needs and an innovative method for fabricating the substrates for such a package. With respect to lead count, this packaging family is...

Publisher: EoPlex Technologies, Inc.

EoPlex Technologies, Inc.

Advanced materials company that builds small devices to generate and manage energy for various manufacturing components.

Redwood City, California, USA

Consultant / Service Provider

Net Ties and How to Use Them

Nov 16, 2010 | Chris Carlson

The Net Tie is a component type which allows for shorting together various nets in a design. The graphic for the symbol can be as simple as two component pins representing a virtual component between nets or as complex as mutipul pins (as many as desired)...

Publisher: Altium

Altium

Altium provides electronics design solutions that help designers create the next generation of electronic products.

La Jolla, California, USA

Consultant / Service Provider

Assembling the Next Electronic Equipment Generations.

Nov 12, 2010 | Sjef v. Gastel, Manager of Advanced Development, Assembléon

Product roadmaps can look like largely theoretical constructs, but assembly requirements five or ten years down the line have very practical importance. Pick & place machines have a life of seven years or more, so they should be working up to 2017 or beyo...

Publisher: Assembléon

Assembléon

Assembleon manufactures a range of Surface Mount Technology (SMT) placement equipment, Pick & Place Machines and provides related services.

LA VELDHOVEN, Netherlands

Manufacturer

Optimizing BNC PCB Footprint Designs for Digital Video Equipment

Nov 06, 2010 | Tsun-kit Chin

An increasing number of video equipment is running at Gigabit rates today. They are interconnected through relatively large size coaxial BNC connectors. While these connectors are in general of good quality, their performance in the equipment depends on ...

Publisher: Samtec, Inc.

Samtec, Inc.

Samtec is recognized as the service leader in the connector industry. Most Samtec products fall into one of three categories: high speed (signal integrity), micro pitch, and rugged/power products.

New Albany, Indiana, USA

Consultant / Service Provider

Conductive Adhesives: TheWay Forward

Nov 04, 2010 | Dr. Ken Gilleo

Conductive Adhesives represent an intrinsically clean, simple and logical solution for a myriad of electrical interconnect challenges. Adhesives not only provide a "lead-free", "no clean" alternative to solder, these highly compatible materials offer viab...

Publisher: Cookson Electronics

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Lakeville, Minnesota, USA

Manufacturer

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