Electronics Manufacturing Technical Articles

A Novel Local Search Integer-Programming-Based Heuristic for PCB Assembly on Collect-and-Place Machines

Nov 03, 2011 | Anupam Seth, Diego Klabjan, Placid M. Ferreira

This paper presents the development of a novel vehicle-routing-based algorithm for optimizing component pick-up and placement on a collect-and-place type machine in printed circuit board manufacturing. We present a two-phase heuristic that produces soluti...

Publisher: Mechanical Science and Engineering at UIUC

Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes

Oct 27, 2011 | Cheryl Tulkoff, Greg Caswell

Leadless, near chip scale packages (LNCSP) like the quad flat pack no lead (QFN) are the fastest growing package types in the electronics industry today. Early LNCSPs were fairly straightforward components with small overall dimensions, a single outer row...

Publisher: DfR Solutions (acquired by ANSYS Inc)

Modelling of Thermal Stresses in Printed Circuit Boards

Oct 20, 2011 | Oldŕich Šuba, Libuše Sýkorová, Štépán Šanda, Michal Stanék

Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters....

Publisher: Tomas Bata University

Are Separate Solder Flip-Chip Bonders Still Required?

Oct 13, 2011 | Eric Klaver, Senior Product Manager, Assembléon. Patrick Huberts, Product Manager Semicon Market.

Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process of manufacturing modules requires placing both passives and (stacked) bare dies, these two types of placement are merging very quickly into a single platform. That raises the question of whether SMT equipment will take over from traditional die bonders....

Publisher: Assembléon

Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology

Oct 06, 2011 | M. Brizoux, A. Grivon, W. C. Maia Filho; Thales Corporate Services. J. Stahr, M. Morianz; AT&S. Hemant Shah, Ed Hickey; Cadence Design Systems Inc.

The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (stacked dies, embedded packaged components). Many companies in the high-end consumer electronics market place have been embedding passive chip components on inner PCB and IC Packages for a few years now. However, embedding packaged components on inner layers has remained elusive for the broader market due to lack of proper design tools and high cost of embedding components on inner layers (...)

This paper will highlight several key industrialization aspects addressed in the frame of the European funded FP7 HERMES* project to build a manufacturing environment for products with embedded components. The program entered its third year and is now dealing with the manufacturing of functional demonstrators as an introduction to industrialization....

Publisher: Cadence Design Systems, Inc.

Criminal Prosecution - Who can be held liable for the sale of counterfeit parts?

Sep 26, 2011 | Kristal Snider, Vice President; ERAI Inc.

On September 14, 2010, the late Shannon Wren, owner of VisionTech Components ("VisionTech"), and Stephanie McCloskey, VisionTech's Administrative Manager, were arrested during the execution of search and seizure warrants issued against the pair by the United States government after evidence connected them to the sale of counterfeit parts to the U.S. Navy, defense contractors and others. A ten-count indictment charged McCloskey with conspiracy, aiding and abetting in violation of Title 18 United States Code, Sections 371 and 2; trafficking in counterfeit goods, in violation of Title 18 United States Code, Section 2320; and mail fraud, in violation of Title 18 United States Code, Section 1341. McCloskey pled guilty to conspiracy and aiding and abetting for her role in the scheme....

Publisher: ERAI Inc.

Best and Simplest Recovery Solution for Missing Data

Sep 26, 2011 | USB Recovery

How to repair flash drive documents when missing due to malicious software installations? Company presents drive recovery software to restore digital files and compressed folders from accidently formatted usb removable media drives....

Publisher: USB Drive Recovery

Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives

Sep 22, 2011 | Ruben Burga, Dr. Mohammed Saad

The remainder of this paper will deal with the adhesive cure mechanism most often found in the microelectronics industry; the thermal activation and cure of adhesives that are most commonly based on epoxy backbones. The use of heat is already prevalent in the microelectronics industry as most printed circuit board assemblies use some element of this thermal energy (reflow ovens for example) during the component soldering and assembly stage or during their burn-in stage (convection ovens)....

Publisher: IRphotonics

Near Term Solutions For 3D Packaging Of High Performance DRAM

Sep 15, 2011 | Vern Solberg, Wael Zohni

The revolution in performance driven electronic systems continues to challenge the IC packaging industry. To enable the new generations of processors to reach their performance potential many manufacturers have developed interface formats to enable greater memory bandwidth. To ensure that the memory functions are able to support the increased signal speed, package developers are relying more and more on innovative 3D package assembly techniques and process refinement....

Publisher: Invensas Corporation

Anisotropic Conductive Adhesive Bonding - A High Quality Interconnection Technique

Sep 08, 2011 | Miyachi Europe GmbH

Anisotropic Conductive Adhesive Bonding is an interconnection technique mostly used for connecting displays to pcb’s using anisotropic conductive adhesive and flex foils. For successful implementation there are a few basic constraints. If these are followed, display connection is a simple and reliable process, giving top quality connections. Heat-Sealing can be done in any factory and can be introduced in a few months, from start of design to mass productions...

Publisher: MIYACHI EUROPE GmbH