Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1757 SMT / PCB Assembly Related Technical Articles

Precision Cleaning in 21st Century: New Solvent with Low Global Warming Potential

Nov 15, 2012 | Rajat Basu, Ryan Hulse, Kane Cook, Diana Mercier

First published in the 2012 IPC APEX EXPO technical conference proceedings. As we progress in the 21st century, electronics manufacturing will need more and more precision. Parts will get more complex since more components have to be assembled in smaller spaces. Circuit boards and other electronic assemblies will become more densely populated; spacings between components will be shorter. This will require precision manufacturing and efficient cleaning during and post manufacturing. In addition, with population and technology progressing, larger amount of greenhouse gases will be emitted resulting in higher global warming. Intense research effort is going on to develop new generation of chemicals to address both cleaning and global warming issues. Low global warming solutions in refrigeration and as insulating agents are already in the marketplace....

Publisher: Honeywell International

Honeywell International

Honeywell is a Fortune 100 company that invents and manufactures technologies to address tough challenges linked to global macrotrends such as safety, security, and energy.

Morristown, New Jersey, USA

Manufacturer

Increase Your Process Control and Lower Cost of Ownership

Nov 12, 2012 | Ed Zamborsky, Eastern Territory Sales Manager, OK International/Metcal

With consumers constantly looking for lower prices on their technology products and manufacturers trying to squeak out higher margins from their production lines, the need for process control and lower overhead costs have become even more important. One sector that is often overlooked is the hand soldering area of the factory. Many factories have been struggling with antiquated soldering systems for years. In some cases they are trying to make their investment in stations last much longer than they were designed for, or they are falsely trying to recoup their original investment ‐ all at the cost of higher operating expenses or even worse, reduced operator thru‐put....

Publisher: Metcal

Metcal

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Manufacturer

Elemental Compositions of Over Two Dozen Cell Phones

Nov 08, 2012 | Bev Christian, Irina Romanova, Laura Turbini

first published in the 2012 IPC APEX EXPO technical conference proceedings. Twenty-nine different cells phones have been disassembled, ground up, dissolved and analyzed for elemental content, mainly for information about the metals present in the phones, but also for some metalloids and non-metals. The paper will discuss the method used and propose possible sources in the telephones for certain elements of interest and the reasons for the interest in some of the elements....

Publisher: Research In Motion

Research In Motion

Research In Motion (RIM) is a leading designer, manufacturer and marketer of innovative wireless solutions for the worldwide mobile communications market.

Waterloo, Ontario, Canada

Manufacturer

Polyphenylene Ether Macromonomers. XI. Use in Non-Epoxy Printed Wiring Boards

Nov 01, 2012 | Edward N. Peters, Scott M. Fisher, Hua Guo

First published in the 2012 IPC APEX EXPO technical conference proceedings. The continuous progression toward portable, high frequency microelectronic systems has placed high demands on material performance, notably low dielectric constants (Dk), low loss tangent (Df), low moisture uptake, and good thermal stability. Epoxy resins are the workhorses of the electronic industry. Significant performance enhancements have been obtained through the use of PPE telechelic macromonomers with epoxy resins. However, there is a ceiling on the performance obtainable from epoxy-based resins. Therefore, non-epoxy based dielectric materials are used to fulfill the need for higher performance....

Publisher: SABIC

SABIC

A world leader in providing engineering thermoplastic material solutions. In more than 35 countries worldwide, we help redefine the way OEMs design -- from concept to reality.

Pittsfield, Massachusetts, USA

Manufacturer

Stencil Printing of Small Apertures

Oct 25, 2012 | William E. Coleman Ph.D.

First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper will examine stencil technologies (including Laser and Electroform), Aperture Wall coatings (including Nickel-Teflon coatings and Nano-coatings), and how these parameters influence paste transfer for miniature devices with Area Ratios less than the standard recommended lower limit of .5. A matrix of print tests will be utilized to compare paste transfer and measure the effectiveness of the different stencil configurations. Area Ratios ranging from .32 to .68 will be investigated....

Publisher: Photo Stencil LLC

Photo Stencil LLC

Photo Stencil provides high-performance stencils, squeegee blades, thick film and metal mask screens and tooling for the surface mount technology (SMT) assembly, solar, and semiconductor industries.

Colorado Springs, Colorado, USA

Manufacturer

Lead-free SMT Soldering Defects How to Prevent Them

Oct 23, 2012 | Peter Biocca, Senior Development Engineer

Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003....

Publisher: Kester

Kester

Kester is a leading global supplier of assembly materials to the electronic assembly, component and microelectronic marketplaces.

Itasca, Illinois, USA

Manufacturer

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

Oct 18, 2012 | Julie Silk, Jianbiao Pan, Mike Powers

First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish....

Publisher: Agilent Technologies, Inc.

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, USA

Manufacturer

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

Oct 11, 2012 | Mustafa Özkök, Joe McGurran, Dieter Metzger, Hugh Roberts

First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless P...

Publisher: Atotech

Atotech

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer

Reliability of BGA Solder Joints after Re-Balling Process

Oct 04, 2012 | M.H. Biglaria, A. Nazariana, R. Denteneera, M. Biglari, Jra, A.A. Kodentsov

First published in the 2012 IPC APEX EXPO technical conference proceedings... Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball t...

Publisher: Mat-tech

Mat-tech

Mat-tech is your specialist in high-tech soldering & brazing. Whether it's developing a new product or improving an existing product, we provide the perfect joint.

Eindhoven, Noord-Brabant, Netherlands

Consultant / Service Provider, Manufacturer

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards

Sep 27, 2012 | Jie Wan, Junqi Tang, Xianping Zeng

First published in the 2012 IPC APEX EXPO technical conference proceedings. Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of withstanding Pb-free soldering processes used in the assembl...

Publisher: Shengyi Technology Co., Ltd.

Shengyi Technology Co., Ltd.

Shengyi is the biggest manufacturer of copper clad laminates in China. Its products are used for making single side, double side, and multilayer printed circuits boards.

Dongguan, Guangdong, China

Manufacturer

Jade Series Selective Soldering Machines
IPC/WHMA-A-620 training Nasa Space Addendum
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