Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1757 SMT / PCB Assembly Related Technical Articles

Bringing Rapid Prototyping In-House - A White Paper for RF/Microwave Executives

Feb 22, 2013 | LPKF

Productivity. Innovation. Time to market. Day to day, year over year, businesses are forced to make critical R.O.I.—related decisions that impact the future and the bottom line—some of them reactionary, some forecasted. For a growing number of electronics manufacturers, many of those decisions revolve around whether a function should be performed by an outside contractor or kept in-house. But for many companies in the RF/microwave industry, this decision is often concerned with continuing to employ an outside PCB fabricator for prototype PCBs, or to make a $10,000 to $100,000 investment in an inhouse, rapid PCB prototyping machine that may represent a key competitive advantage....

Publisher: LPKF Laser & Electronics

LPKF Laser & Electronics

With its broad product range LPKF is one of the world market leaders in the "in-house rapid PCB prototyping" and "StencilLaser" services

Tualatin, Oregon, USA

Manufacturer

Boundary Scan Advanced Diagnostic Methods

Feb 14, 2013 | Christopher Cain

Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC testing to detect intra-IC interconnect assembly faults, such as solder shorts and opens. Today's advanced IC technology now includes high-speed differential interfaces that include AC or DC coupling components loaded on the printed circuit assembly. Simple stuck-at-high/low test methods are not sufficient to detect all assembly fault conditions, which includes shorts, opens and missing components. Improved diagnostics requires detailed circuit analysis, predictive assembly fault simulation and more complex testing to isolate and accurately detect all possible assembly faults... First published in the 2012 IPC APEX EXPO technical conference proceedings...

Publisher: Agilent Technologies, Inc.

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, USA

Manufacturer

Avoiding the Solder Void

Feb 08, 2013 | Richard Lathrop

Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method can be quite subjective for non grid array components due to the two dimensional aspects of X-ray images and software limitations. A novel method of making a copper "sandwich" to simulate under lead and under component environs during reflow has been developed and is discussed in detail. This method has enabled quantitative solder paste void analysis for lead free and specialty paste development and process refinement. Profile and paste storage effects on voiding are discussed. Additionally an optimal design and material selection from a solder void standpoint for a heat spreader on a BCC (Bumpered Chip Carrier) has been developed and is discussed....

Publisher: Heraeus

Heraeus

We design and manufacture SMT assembly materials.

W. Conshohocken, Pennsylvania, USA

Manufacturer

Effect of Silicone Contamination on Assembly Processes

Feb 07, 2013 | John Meyer and Carlyn A. Smith, Ph.D.

Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings....

Publisher: Harris Corporation

Harris Corporation

Harris Corporation is a high-tech communications and information processing company, providing products and services to customers around the world.

Melbourne, Florida, USA

Manufacturer

Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages

Jan 31, 2013 | Joe Thomas

There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices, the emergence of lead-free processing, and changes in device form factors. Warpage measurement has become a key measurement for analysis; prevention and prediction of interconnect defects and has been employed in failure analysis labs and production sites worldwide. First published in the 2012 IPC APEX EXPO technical conference proceedings...

Publisher: ZN Technologies

ZN Technologies

ZN Technologies (www.zntechnologies.com) specializes in assisting microelectronics companies achieve manufacturing efficiencies and yield/reliability improvement with our unique set of R&D/Failure Analysis capital equipment.

Marietta, Georgia, USA

Consultant / Service Provider

Inline Wire and Cable Identification

Jan 30, 2013 | Pete Doyon, VP of Product Management

Many OEM’s require that individual wires and cables used in their products be clearly identified with a mark or label. For some, such as in the military and aerospace markets, wire and cable identification (or “wire ID”) is mandatory and the process is governed by stringent specifications, such as SAE AS50881 (formerly MIL5088L). For others, the decision to use wire ID is a voluntary one. This article will describe what type of information is typically identified on wire and cables, concepts for improved productivity, what types of systems are available and the pros and cons of each....

Publisher: Schleuniger, Inc.

Schleuniger, Inc.

Schleuniger, Inc. is a leading manufacturer of wire processing equipment. Our innovative automatic and semi-automatic machines are designed to cut, strip, crimp and mark all types of wire and cable.

Manchester, New Hampshire, USA

Other

Choosing the Right Cutting and Stripping Machine – It’s all about the apps

Jan 29, 2013 | Pete Doyon, VP Product Management

Choosing a new wire Cutting and Stripping (C&S) machine can be like shopping for a new car. With so many choices, where does one start? A nice, little sports car might be fun to have, but how often will it just sit there because it can’t carry a car load of kids or some odd-sized goods from the local home improvement store? You just might be better off with a midsize SUV that does a pretty good job at doing everything you need it to do....

Publisher: Schleuniger, Inc.

Schleuniger, Inc.

Schleuniger, Inc. is a leading manufacturer of wire processing equipment. Our innovative automatic and semi-automatic machines are designed to cut, strip, crimp and mark all types of wire and cable.

Manchester, New Hampshire, USA

Other

Internet Marketing Article 01-24-2013

Jan 24, 2013 | Roland Girouard

Being found in the search engines for a wide variety of terms directly related to my business would be my 1st priority......

Publisher: SMTnet

SMTnet

Helping businesses find each other.

Portland, Maine, USA

Consultant / Service Provider, Marketing Agency, Media / Publisher / Online Resource, Other

An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications

Jan 24, 2013 | Jasbir Bath, Manabu Itoh, Gordon Clark, Hajime Takahashi, Kyosuke Yokota, Kentaro Asai, Atsushi Irisawa, Kimiaki Mori, David Rund, Roberto Garcia

The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported....

Publisher: Christopher Associates Inc.

Christopher Associates Inc.

A pioneering supplier and distributor to the electronics and chemical processing industries.

Santa Ana, California, USA

Manufacturer

Brief description of ENIG for Multilayer PCB

Jan 18, 2013 | Grace

ENIG (Electroless Nickel/Immersion Gold) is to deposit nickel gold plating which has good solderability, wear resistance , leveling appearance and small electric resistance. It included 4 steps that are pretreatment, immersion nickel, immersion gold and Post treatment......

Publisher: Everest PCB equipment Co.,Ltd

Everest PCB equipment Co.,Ltd

EVEREST is a manufacturer of PCB equipment in China.We are focus on providing the best products and services for our clients. After making efforts for several years, we are in the lead leve

Beijing, China

Manufacturer

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