SMT, PCB, EMS Technical Articles

Evaluation Report Medium Temperature Dry Cabinet

Feb 07, 2024 | Totech

Report of different drying temperatures...

Totech Canada operates in North America as the official distributor for TOTECH Japan SUPERDRY/AUTODRY Humidity & Temperature controlled Dry Cabinets, A Industry leader in Dry Cabinets since 1973, Sales & service in the N/S America

Montreal, Canada

Consultant / Service Provider, Distributor, Manufacturer

Inline Quality Control and Position Detection in Dispensing Systems

Feb 06, 2024 | Scheugenpflug

Quality monitoring for verifiable, high-precision application of adhesives and sealants now begins with detecting the position of the component. Dispensing systems are in continuous use and have to work with 100 percent accuracy. And this level of accuracy must be verifiable. Demands on electronic components continue to escalate as these components also need to operate continuously and flawlessly, especially in the automotive and medical sectors. At the same time, there is increasing pressure to automate as companies are looking to achieve the shortest possible cycle times and maximum output....

Publisher: Scheugenpflug Inc.

Scheugenpflug Inc.

Producer of bonding, dispensing and potting solutions with outstanding expertise in automation. As part of the Atlas Copco Group, we have a worldwide sales & service network and access to the Group's extensive technology portfolio

Kennesaw, Georgia, USA

Manufacturer

Moisture-Sensitive Components

Feb 05, 2024 | Robert Rowland

The topic of moisture-sensitive components is rather boring but very important -- and frequently misunderstood. Increased moisture-sensitive component use, such as thin fine-pitch devices and ball grid arrays (BGA), has increased concern for this failure mechanism. When components are exposed to the elevated temperatures that occur during reflow soldering, moisture trapped inside plastic surface mount devices (SMD) produces enough vapor pressure to damage or destroy the device. Common failure modes include internal separation (delamination) of the plastic from the die or lead-frame; wire bond damage; die damage; and internal cracks that do not extend to the component surface. In extreme cases, cracks will extend to the component surface; in the most severe cases, the component will bulge and pop (referred to as the "popcorn" effect)....

Publisher: Radisys Corporation

Radisys Corporation

Radisys Corpatioorn is an American technology company located in Hillsboro, Oregon, USA that makes technology used by telecommunications companies in mobile networks. Founded in 1987 in Oregon by former employees.of Intel.

Hillsboro, USA

Manufacturer

Guidelines/recommendations "Drying of PCBs before soldering"

Feb 05, 2024 | ZVEI

Objective:  Drying = reducing the humidity in PCB before soldering  Preventing delamination caused by thermal stress after moisture absorption Methods:  Drying in convection and/ or vacuum oven  Parameters subject to material type, soldering surface, layer count, time to soldering, layout (copper-plated areas)...

Publisher: ZVEI - German Electro and Digital Industry Association

ZVEI - German Electro and Digital Industry Association

The ZVEI is one of the most important manufacturers' associations in Germany. It represents the interests of a high-tech branch with a very widely varied and extremely dynamic product portfolio.

Frankfurt am Main, Germany

Association / Non-Profit

A Bus Planning Algorithm for FPC Design in Complex Scenarios_2_Preliminaries

Feb 03, 2024 | wangfeng

Flexible printed circuit(FPC) design in complex scenarios has a list of pin concentration areas, which lead to extremely congested intersection regions while connecting the pins.Currently,it is challengingto explore the routability and to find topologically non-cross-ing and routable paths manually for the nets timely. The existing bus planning methods cannot offer optimal solutions concerning the special resource distribution of FPC design.To investigate an effective way to shorten the routing time of FPC and achieve enhanced performance, a bus planning algorithm is proposed to tackle complex area connection problems. On the basis of the pin location in- formation, the routing space is partitioned and generally represented as an undirected graph, and the topological non-crossing relationship between different regions is obtained using the dynamic pin sequence. Considering the routability and electrical constraints, a heuristic algorithm is proposed to search the optimal location of the crossing point on the region boundary. Experimental results on industrial cases show that the proposed algorithm realize better performance in terms of count and routability in comparison with numerous selected state-of-the-art router and methods....

Publisher: FPCWay

FPCWay

Full feature custom flex PCB prototype service at low cost. FPCWay has been committed to meeting the needs of our customers by providing the best and most efficient flex PCB Manufacturer experience from flex pcb quote to deliver

Shenzhen, China

Consultant / Service Provider

A Bus Planning Algorithm for FPC Design in Complex Scenarios_1_Introduction

Feb 03, 2024 | wangfeng

Flexible printed circuit(FPC) design in complex scenarios has a list of pin concentration areas, which lead to extremely congested intersection regions while connecting the pins.Currently,it is challengingto explore the routability and to find topologically non-cross-ing and routable paths manually for the nets timely. The existing bus planning methods cannot offer optimal solutions concerning the special resource distribution of FPC design.To investigate an effective way to shorten the routing time of FPC and achieve enhanced performance, a bus planning algorithm is proposed to tackle complex area connection problems. On the basis of the pin location in- formation, the routing space is partitioned and generally represented as an undirected graph, and the topological non-crossing relationship between different regions is obtained using the dynamic pin sequence. Considering the routability and electrical constraints, a heuristic algorithm is proposed to search the optimal location of the crossing point on the region boundary. Experimental results on industrial cases show that the proposed algorithm realize better performance in terms of count and routability in comparison with numerous selected state-of-the-art router and methods....

Publisher: FPCWay

FPCWay

Full feature custom flex PCB prototype service at low cost. FPCWay has been committed to meeting the needs of our customers by providing the best and most efficient flex PCB Manufacturer experience from flex pcb quote to deliver

Shenzhen, China

Consultant / Service Provider

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer

Feb 02, 2024 | I.C.T

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness....

Publisher: I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T ( Dongguan ICT Technology Co., Ltd. )

I.C.T is a manufacturer from China that offers SMT, DIP, PCBA conformal coating equipment and turnkey solution.

Dongguan, China

Manufacturer

Critical Evaluation of Relative Importance of Stress and Stress Gradient in Whisker Growth in Sn Coatings

Jan 29, 2024 | PIYUSH JAGTAP, VIJAY A. SETHURAMAN, and PRAVEEN KUMAR

The role of stress state and stress gradient in whisker growth in Sn coatings electrodeposited on brass is examined. The bulk stress in Sn coatings was measured using a laser-optics-based curvature setup, whereas glancing angle x-ray diffraction was employed to quantify the stress near the surface; this also allowed studying the role of the out-of-plane stress gradient in whisker growth. Both bulk stress and near-surface stress in the Sn coating evolved with time, wherein both were compressive immediately after the deposition, and thereafter while the bulk stress monotonically became more compressive and subsequently saturated with aging at room temperature, the stress near the surface of the Sn coating continually became more tensile with aging. These opposing evolutionary behaviors of bulk and near-surface stresses readily reveals establishment of a negative out-of-plane stress gradient, which is required for the spontaneous growth of whiskers. The importance of the outof- plane stress gradient was also validated by externally imposing widely different stress states and stress gradients in Sn coatings using a 3-point bending apparatus. Additional whisker growth occurred in the coatings subjected to external tensile stress; however, this was accompanied by a higher negative out-of-plane stress gradient. The results conclusively demonstrate the important role of the negative out-of-plane stress gradient on whisker growth, as compared to only sign and magnitude of stress.

...

Publisher: Indian Institute of Science

Indian Institute of Science

The Indian Institute of Science is a public, deemed, research university for higher education and research in science, engineering, design, and management. It is located in the southern Indian city of Bangalore, Karnataka.

Bengaluru, India

Research Institute / Laboratory / School

Assembly and Rework of Lead Free Package on Package Technology

Jan 16, 2024 | Raymond G. Clark and Joseph D. Poole

Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages has found wide acceptance by both designers and manufactures of electronics alike. Lead free Package on Package (PoP) technology represents one of the latest advancements in vertical electronics packaging integration and has become the preferred technology for mobile hand held electronics applications. TT Electronics in Perry, Ohio has developed the capability to assemble and rework numerous "state of the art" packaging technologies. This paper will focus on the essential engineering development activities performed to demonstrate TT Electronics' ability to both assemble and rework PoP components....

Publisher: TT Electronics

TT Electronics

Solving technology challenges for a sustainable world Take a closer look at TT and you'll soon discover that the most important things we offer aren't manufactured...

Perry, Ohio, USA

Manufacturer

Unlocking Success in PCB Design: A Comprehensive Guide for Beginners

Jan 13, 2024 | Muhammad Aamir

Navigating the world of PCB design, fabrication, and assembly requires a blend of technical expertise and strategic planning. In this comprehensive guide, we delve into the fundamental principles of PCB design, offering valuable insights and tips for both beginners and experienced designers. From optimizing schematic designs to mastering component placement and routing techniques, this guide provides actionable advice to enhance your PCB projects. Beyond the design phase, the blog explores the critical aspects of reliable fabrication and assembly services. It introduces XLPCB, a leading PCB service provider in Pakistan, offering advanced solutions and expertise in tools like Eagle and KiCad. Discover the advantages of partnering with XLPCB, where a commitment to quality and precision ensures the success of your PCB projects. Embark on your PCB design journey armed with knowledge, tips, and the support of a trusted service provider. Visit XLPCB to elevate your projects and turn your design visions into reality....

Publisher: XLPCB

XLPCB

Your One-Stop Solution for Electronics Projects.From PCB Designing to Fabrication and Assembly. At XLPCB, we take pride in providing high-quality manufacturing of printed circuit board PCBA with the least lead time in the industry

Lahore Pakistan, Pakistan

Manufacturer