Electronics Manufacturing Technical Articles

A Low Cost Manufacturing Solution - Low Temperature Super-Fast Cure and Flow Reworkable Underfill

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

In order to meet the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, underfilling has increasingly become an essential process for the good reliability of electronic devices. Filled capillary underfill has been selected for used in package-level where there is large thermal stress caused by CTE mismatch issue, but the underfill is usually not reworkable. Unfilled capillary underfill has been used for board-level application such as BGA/CSP, POP, WL-CSP where there is need for mechanical shock resistance, the underfill is usually reworkable....

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

A Room Temperature Stable and Jetable Solder Joint Encapsulant Adhesive - Capillary Underfill Replacement

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

With the increasing demand of device miniaturization, high speed, more memory, more function, low cost, and more flexibility in device design and manufacturing chain, YINCAE has published a white paper on a first individual solder joint encapsulant which can eliminate underfilling process with at least five times solder joint increase and provide more flexibility for fine pitch and high density application. In order to meet the demand of manufacturing of high speed and low cost, YINCAE has invented a room temperature stable and jettable solder joint encapsulant adhesive – SMT 266. The invention of SMT 266 has allowed our customers to have more flexibility in their high-speed production line such as worry free on the work life of adhesive and workable jetting process....

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

A Low Temperature Solder Joint Encapsulant for Sn/Bi Applications

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield, eliminate the head-in-pillow effect, and enhance rework yield. However, Sn/Bi alloy is not strong enough to replace lead-free (SAC) and eutectic Sn/Pb alloys in most applications. In order to improve the strength of Sn/Bi solder joints, enhance mechanical performance, and improve reliability properties such as thermal cycling performance of soldered electronic devices, YINCAE has developed a low temperature solder joint encapsulant for Sn/Bi soldering applications. This low temperature solder joint encapsulant can be dipped, dispensed, or printed. After reflow with Sn/Bi solder paste or alloy, solder joint encapsulant encapsulates the solder joint. As a result, the strength of solder joints is enhanced by several times, and thermal cycling performance is significantly improved. All details will be discussed in this paper....

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

Solderable Anisotropic Conductive Adhesives for 3D Package Applications

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

3D packaging has recently become very attractive because it can provide more flexibility in device design and supply chain, reduce the gap between silicon die and organic substrate, help miniaturize devices and meet the demand of high speed, provide more memory, more function and low cost. With the advancement of 3D packaging, the bump height is now down from 80μ to 10μ. When the bump diameter is 20-40μ and height 10μ, the process and reliability are obvious issues. It is well known that underfill can enhance the reliability for regular flip chip, however underfill won’t help assembly process. In order to resolve some difficulties that 3D packaging faces, YINCAE Advanced Materials, LLC has developed solderable anisotropic conductive adhesives for 3D package applications. In this paper we will discuss the assembly process and reliability in detail....

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

An Innovative Reliability Solution to Interconnect of Flexible/Rigid Substrates

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

With the pitch size of interconnect getting finer and finer, the bonding strength between flexible and rigid (e.g. PCB, ceramic) substrates becomes a serious issue because it is not strong enough to meet the customer’s requirement. Capillary underfill has been used to enhance the bonding strength between flexible and rigid substrates, but the enhancement is very limited, particularly for high temperature application. The bonding strength of underfilled flexible/rigid interconnect is dramatically decreased after being used at 180◦C, and the interconnects are weakened by the internal stress caused by the expansion of underfill at high temperatures. In order to resolve reliability issues of the interconnect between flexible/rigid substrates, solder joint encapsulant was implemented into the thermal compression bonding process, which was used to manufacture the interconnect between flexible/rigid substrates. Compared to the traditional process, the strength of the interconnect was doubled and the reliability was significantly improved in high temperature application....

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

Solder Joint Encapsulant Adhesive - LGA High Reliability And Low Cost Assembly Solution

Jan 12, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper....

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA

The Future of Solder Joint Encapsulant

Jan 08, 2016 | Dr. Mary Liu and Dr. Wusheng Yin

Solder joint encapsulant adhesives have been successfully used to enhance the strength of solder joints and improve thermal cycling as well as drop performance in finished products. The use of solder joint encapsulant adhesives can eliminate the need for underfill materials and the underfill process altogether, thus simplifying rework, which results in a lower cost of ownership.

Solder joint encapsulant adhesives include: low temperature and high temperature solder joint encapsulant adhesives, and their derivatives. Each solder joint encapsulant adhesive has: unfilled and filled solder joint encapsulant adhesives, and solder joint encapsulant paste. Each solder joint encapsulant product has been designed for different applications. In this paper, we are going to discuss the details and future of solder joint encapsulant adhesives. ...

Yincae Advanced Materials, LLC is a developer, manufacturer, and supplier of high performance coatings, adhesives, electronic and optoelectronic materials.

Albany, New York, USA