Technical Articles From Lamsim Enterprises Inc.
Read technical articles about electronics manufacturing added by Lamsim Enterprises Inc.
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3 technical articles added by Lamsim Enterprises Inc.
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Method of Modeling Differential Vias
Mar 17, 2011 | Lambert Simonovich, Dr. Eric Bogatin, Dr. Yazi Cao,
Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high bandwidth, scalable first approximation circuit model using simple transmission lines o...
Backplane Architecture High-Level Design
Mar 16, 2011 | Lambert Simonovich
The backplane is the key component in any system architecture. The sooner one considers the backplane’s physical architecture near the beginning of a project, the more successful the project will be. This white paper introduces the concept of a backplane ...
Practical Fiber Weave Effect Modeling
Mar 16, 2011 | Lambert Simonovich
Fiber weave effect is becoming more of an issue as bit rates continue to sore upwards to 5GB/s and beyond. Due to the non-homogenous nature of printed circuit board laminates, the fiberglass weave pattern causes signals to propagate at different speeds wi...
