Electronics Manufacturing Technical Articles

Intermetallic Compounds In Solar Cell Interconnections Including Lead-Free, Low Melting Point Solders

Oct 05, 2017 | Torsten Geipel, Achim Kraft, Ulrich Eitner - ISE, Monja Moeller - Kiel University

Intermetallic compounds (IMC) in solder bonds are commonly considered critical for the reliability of interconnections. The microstructure and thermal aging characteristics of solder bonds of crystalline silicon solar cells are investigated, whereby two solders, Sn60Pb40 and a lead-free, low melting point alternative Sn41Bi57Ag2 are considered....

Publisher: Fraunhofer Insitute for Solar Energy Systems ISE

An Investigation into the Use of Nano-Coated Stencils to Improve Solder Paste Printing with Small Stencil Aperture Area Ratios

Sep 28, 2017 | Jasbir Bath, Tony Lentz, Greg Smith

These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge.

This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs....

Publisher: FCT ASSEMBLY, INC.

Flex Circuit Manufacturing for Innovative Product Design

Sep 27, 2017 | Tuan Tran

Flex and rigid flex circuits have become increasingly popular in the high-density electronics industry for their cost-saving three-dimensional configurations. The ability to build circuitry to fit the device instead of the other way around, offers significant advantages for complex aerospace, military, and medical device applications....

Publisher: Power Design Services

Laser Wire Stripping for Medical Device Manufacturing Applications

Sep 25, 2017 | Pete Doyon, VP, Product Management, Schleuniger, Inc.

Laser wire stripping was developed by NASA in the 1970s as part of the Space Shuttle program. The technology made it possible to use smaller sized wires with thinner insulations, without risk of the damage that can be caused by traditional mechanical wire stripping methods. Laser wire stripping technology was commercialized in the 1990s and was initially used for aerospace and defense applications. Laser wire stripping then grew significantly when the consumer electronics market exploded as lasers became the only stripping solution for the tiny data cables found in laptops, mobile phones and other consumer electronics products. Another large industry that has adopted laser wire stripping methods, and for good reason, is high-end medical device manufacturing. ...

Publisher: Schleuniger, Inc.

2.5D and 3D Semiconductor Package Technology: Evolution and Innovation

Sep 14, 2017 | Vern Solberg

The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the shorter interconnect resulting from this effort has contributed to improving both electrical performance and functional capability. (...)

This paper outlines both positive and negative aspects of current 3D package innovations and addresses the challenges facing adopters of silicon and glass based interposer fabrication. The material presented will also reference 3D packaging standards and recognize innovative technologies from a number of industry sources, roadmaps and market forecasts....

Publisher: Vern Solberg - Solberg Technical Consulting

The Relationship Between Energy-Resource Depletion, Climate Change, Health Resources and the Environmental Kuznets Curve: Evidence From the Panel of Selected Developed Countries

Sep 13, 2017 | Syed Abdu lRehman Khan, Khalid Zaman, YuZhang

The objective of the study is to examine the relationship between energy-resource depletion, climate change, health resources and the Environmental Kuznets Curve(EKC) under the financial constraint environment in the panel of selected developed countries, over the period of 2000–2013....

Publisher: Changan University

Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift

Sep 07, 2017 | Young K. Song and Vanja Bukva

As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized....

Publisher: Teledyne DALSA

NSOP Reduction for QFN RFIC Packages

Aug 31, 2017 | Mumtaz Y. Bora

Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields.

Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction...

Publisher: Peregrine Semiconductor

The Importance of On‐Site Training for PCB Assembly

Aug 28, 2017 | Tuan Tran

If there is one way to guarantee world-class results in the electronics industry, it's by ensuring factory floor technicians enjoy consistent, regular training. Regular training ensures that assembly line technicians use standardized methods, generating efficiencies and improving the assembly process....

Publisher: Power Design Services

How Does 3D AOI Increase Manufacturing Quality?

Aug 28, 2017 | Tuan Tran

PCB suppliers in the automotive space are vastly accelerating their time to market by using automated optical inspection (AOI) systems during PCB assembly. However, this next-generation technique is not limited in scope to the automotive industry – it has powerful implications for the entire PCB industry....

Publisher: Power Design Services