Electronics Manufacturing Technical Articles

Electronics Manufacturing Technical Articles

Papers and articles related to SMT, PCB & EMS industry.

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1789 SMT / PCB Assembly Related Technical Articles

Material & Process Influences on Conductive Anodic Filamentation (CAF)

Mar 16, 2023 | Alun Morgan and Doug Trobough

HISTORY: * In the late 1970s an abrupt unpredictable loss of insulation resistance was observed in PCBs, which were subject to hostile climatic conditions of high relative humidity and temperature while having an applied voltage. * The loss of resistance, even leading to a short circuit was observed to be due to the growth of a subsurface filament from the anode to the cathode. * The term "Conductive Anodic Filamentation" (CAF) was coined....

Publisher: Isola Group

Isola Group

Isola a global material sciences company focused on designing, developing, manufacturing and marketing copper-clad laminates and dielectric prepregs used to fabricate advanced multilayer PCBs.

Chandler, Arizona, USA

Manufacturer

Conductive Anodic Filament (CAF) Formation: A Potential Reliability Problem for Fine-Line Circuits

Mar 16, 2023 | Laura J. Turbini, W. Jud Ready & Brian A. Smith

Outline * Introduction & Background * Factors Affecting CAF Formation * CAF Formation ** Catastrophic Field Failure of Military Hardware ** Laboratory Experiments * Conclusion...

Publisher: Georgia Institute of Technology

Georgia Institute of Technology

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems

Atlanta, Georgia, USA

Research Institute / Laboratory / School

Conductive Anodic Filament Failure: A Materials Perspective

Mar 16, 2023 | Laura J. Turbini and W. Jud Ready

Conductive anodic filament (CAF) formation was first reported in 1976.1 This electrochemical failure mode of electronic substrates involves the growth of a copper containing filament subsurface along the epoxy-glass interface, from anode to cathode. Despite the projected lifetime reduction due to CAF, field failures were not identified in the 1980s. Recently, however, field failures of critical equipment have been reported.2 A thorough understanding of the nature of CAF is needed in order to prevent this catastrophic failure from affecting electronic assemblies in the future. Such an understanding requires a comprehensive evaluation of the factors that enhance CAF formation. These factors can be grouped into two types: (1) internal variables and (2) external influences. Internal variables include the composition of the circuit board material, and the conductor metallization and configuration (i.e. via to via, via to surface conductor or surface conductors to surface conductors). External influences can be due to (1) production and (2) storage and use. During production, the flux or hot air solder leveling (HASL) fluid choice, number and severity of temperature cycles, and the method of cleaning may influence CAF resistance. During storage and use, the principal concern is moisture uptake resulting from the ambient humidity. This paper will report on the relationship between these various factors and the formation of CAF. Specifically, we will explore the influences of printed wiring board (PWB) substrate choice as well as the influence of the soldering flux and HASL fluid choices. Due to the ever-increasing circuit density of electronic assemblies, CAF field failures are expected to increase unless careful attention is focused on material and processing choices....

Publisher: Georgia Institute of Technology

Georgia Institute of Technology

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems

Atlanta, Georgia, USA

Research Institute / Laboratory / School

Paper Substrates and Inks for Printed Electronics

Mar 13, 2023 | Laura K. Wood†, Erika Hrehorova, Thomas W. Joyce†, Paul D. Fleming, Margaret Joyce†, Alexandra Pekarovicova and Valery Bliznyuk

The present work explores the effects of paper properties on conventional silver-based conducting inks. The effects of smoothness, relative humidity, porosity, permeability and wettability on electrical properties of silver inks on different paper substrates were studied. Another objective of this work was to prepare and study polyaniline synthesized in the presence of different lignosulfonates....

Publisher: Western Michigan University

Western Michigan University

A national research university enrolling nearly 25,000 students from across the United States and more than 100 other countries.

Kalamazoo, Michigan, USA

Research Institute / Laboratory / School

Printed Electronics: Manufacturing Technologies and Applications

Mar 13, 2023 | Chuck Zhang

Translational Research in Additive Manufacturing at GTMI * Additive manufacturing/3D printing process and equipment development (e.g., metal, polymer and composites part manufacturing) * Computational modeling and simulation of additive manufacturing/printed electronics processes * Advanced materials development for additive manufacturing/printed electronics * Application development and demonstration of additive manufacturing/printed electronics...

Publisher: Georgia Institute of Technology

Georgia Institute of Technology

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems

Atlanta, Georgia, USA

Research Institute / Laboratory / School

Modeling Resistance Increase In A Composite Ink Under Cyclic Loading

Mar 13, 2023 | Q Li, E Chung, A Antoniou and O Pierron

The electrical performance of stretchable electronic inks degrades as they undergo cyclic deformation during use, posing a major challenge to their reliability. The experimental characterization of ink fatigue behavior can be a time-consuming process, and models allowing accurate resistance evolution and life estimates are needed. Here, a model is proposed for determining the electrical resistance evolution during cyclic loading of a screen-printed composite conductive ink. The model relies on two input specimen-characteristic curves, assumes a constant rate of normalized resistance increase for a given strain amplitude, and incorporates the effects of both mean strain and strain amplitude. The model predicts the normalized resistance evolution of a cyclic test with reasonable accuracy. The mean strain effects are secondary compared to strain amplitude, except for large strain amplitudes (>10%) and mean strains (>30%). A trace width effect is found for the fatigue behavior of 1 mm vs 2 mm wide specimens. The input specimen-characteristic curves are trace-width dependent, and the model predicts a decrease in Nf by a factor of up to 2 for the narrower trace width, in agreement with the experimental results. Two different methods are investigated to generate the rate of normalized resistance increase curves: uninterrupted fatigue tests (requiring ∼6–7 cyclic tests), and a single interrupted cyclic test (requiring only one specimen tested at progressively higher strain amplitude values). The results suggest that the initial decrease in normalized resistance rate only occurs for specimens with no prior loading. The minimum-rate curve is therefore recommended for more accurate fatigue estimates....

Publisher: Georgia Institute of Technology

Georgia Institute of Technology

Center for Board Assembly Research CBAR- advanced research on board assembly processes and systems

Atlanta, Georgia, USA

Research Institute / Laboratory / School

An Introduction To The Process Of Printed Electronics

Mar 13, 2023 | S.G.R. Avuthu, Ph.D., M. Gill, N Ghalib, M. Sussman, G. Wable, J. Richstein, Ph.D.

Printed electronics (PE) is impacting almost every branch of manufacturing. The printing of electronics on mechanically flexible substrates such as plastic, paper and textile, using traditional printing techniques, provides novel applications for wearable and stretchable electronics. Government sponsored consortiums, universities, contract printers, startups and global manufacturers are developing processes to bring this technology to market faster, more costeffectively and at scale. By increasing the speed of technology adoption while following industrialization best practices, industry researchers aim to create processes that ramp up the scale of production for simple circuits and integrated conductive structures....

Publisher: Jabil Circuit, Inc.

Jabil Circuit, Inc.

An electronic product solutions company providing comprehensive electronics design, manufacturing and product management services.

St. Petersburg, Florida, USA

Consultant / Service Provider

Printable Electronics: Towards Materials Development And Device Fabrication

Mar 13, 2023 | Rabindra N. Das, How T. Lin, John M. Lauffer and Voya R. Markovich

Purpose – There has been increasing interest in the development of printable electronics to meet the growing demand for low-cost, large-area, miniaturized, flexible and lightweight devices. The purpose of this paper is to discuss the electronic application of novel printable materials. Design/methodology/approach – The paper addresses the utilization of polymer nanocomposites as it relates to printable and flexible technology for electronic packaging. Printable technology such as screen-printing, ink-jet printing, and microcontact printing provides a fully additive, non-contacting deposition method that is suitable for flexible production....

Publisher: i3 Electronics

i3 Electronics

A world leader in high-performance PCB fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D.

Endicott, New York, USA

Manufacturer

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Mar 04, 2023 | Management representative

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Publisher: Hiflo Solders Private Limited

Hiflo Solders Private Limited

Hiflo Solders Private Ltd (HSPL) , was established in the early nineties and has grown into a business enterprise in manufacturing and marketing of Solders, Fluxes, Cleaners, Anodes, Soldering Accessories for the domestic & inte

Chennai, Tamil Nadu, India, Tamil Nadu, Guyana

Manufacturer, Manufacturer's Representative

PCB terminology you must know

Feb 28, 2023 | FS PCBA

With the popularization of electronic products, more and more people know the importance of printed circuit board (PCB), but it is a very complicated and huge knowledge system. In this article, we will discuss some terms about the PCB industry so that you can better understand the circuit board. Printed circuit board professional noun Array: Usually we also refer to it as panelized, stepped or palletized PCB, which refers to the combination of multiple copies of the PCB into a connected matrix of circuit boards. Usually we refer to the PCB as the bare board of the circuit board, that is, the part that does not contain components, it is not working, and the electronics manufacturer needs to find a suitable PCBA processing plant to complete the assembly after completing the PCB manufacturing. Through the above-mentioned assembly method, PCBA company can complete the assembly work faster. https://www.fs-pcba.com/ Board Aspect Ratio: It is the ratio between board thickness and minimum via diameter, which is very important. We know that a circuit board is an electronic product that contains circuit images, and the circuit diagrams are formed during production through methods such as SUV exposure. In order to ensure the accuracy of circuit images and assembly work, designers need to ensure a lower aspect ratio to reduce potential risks that may arise. Cable: It is used for the transmission of electric current just like the wires in our daily life. There are various wires in electronic products, these wires connect different components, and they are electrically connected to each other to operate. https://www.fs-pcba.com/manufacturing-pcb/ Main body: As mentioned above, the PCB board cannot operate alone, but the components are mounted on the surface of the bare board through PCB assembly. These components are very small, but when they are installed, there are many extra parts such as: pins, leads and accessories. In order to accurately express their views, designers usually use the main body of the component to represent the central part of the electronic component. https://www.fs-pcba.com/assembly-pcb/ More Interesting Board Articles The PCB industry involves a lot of content. In order to complete a complete PCBA board, we need to go through multiple links, such as design, manufacturing, assembly, testing, etc., and there are more categories under each link. If you want to know more about this industry, it will be helpful for you to read more about PCB....

Publisher: FS Technology

FS Technology

FS Technology: a pcba supplier dedicated to one-stop service.This is our website: https://www.fs-pcba.com/

shenzhen, Guangdong, China

Manufacturer

Jade Series Selective Soldering Machines
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