Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs

Published:	October 16, 2014
Author:	Rama Hegde, senior member of technical staff; Freescale Semiconductor.
Abstract:	Key points are: Long-term storage of BGA & QFP products may be required due to: Fab and assembly factory transfers Product obsolescence requiring customers make lifetime/EOL purchases Providing extended service (10+ years) on vehicles Other program needs Integrity of EOL products in terms of solderability needs to be verified....

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