Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill
Published: |
January 2, 2014 |
Author: |
Bankeem Chheda and S. Manian Ramkumar, Ph.D.; Rochester Institute of Technology-CEMA, Reza Ghaffarian; Ph.D. Jet Propulsion Laboratory. |
Abstract: |
With ROHS compliance the transition to lead-free is inevitable. Several lead-free alloys are available in the market and its reliability has been the main concern. The results from this experimental research aims at making a comparison of different lead-free alloy combinations. Thermal shock and drop tests are a part of this experimental study.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from Jet Propulsion Laboratory »
- Jul 30, 2019 - Design Parameters Influening Reliability of CCGA Assembly; a Sensitivity Analysis
- Apr 17, 2019 - Reliability of ENEPIG by Sequential Thermal Cycling and Aging
- Dec 12, 2018 - Assembly Reliability of TSOP/DFN PoP Stack Package
- Jun 22, 2017 - Defect Features Detected by Acoustic Emission for Flip-Chip CGA/FCBGA/PBGA/FPBGA Packages and Assemblies
- Mar 14, 2013 - Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
- See all SMT / PCB technical articles from Jet Propulsion Laboratory »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill article has been viewed 1189 times