Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson
Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll
Electronics Forum | Tue Feb 20 13:10:54 EST 2001 | billschreiber
Hello Dave, Before I get into waste management, I must first stress the importance of checking with your local regulating agencies. Every area can be and usually is different. California regulations differ from Ohio and Ohio�s are different than Mu
Electronics Forum | Fri Mar 12 18:12:15 EST 1999 | B. Walton
Spray cleaners are poor alternatives to todays ultrasonic stencil cleaners. Ultrasonics are the way to go and you can use rather benign water based chemistries to get the job done. As for screening adhesives and cleaning glue residue with spray wands
Electronics Forum | Mon Mar 08 05:11:36 EST 1999 | Earl Moon
| | | And on it goes. Again, I can't thank you enough for your time. I will call you soon as others probably find this rhetoric a bit much. | | | | Earl Moon | | | Earl and Dean, | | No,no,no...please continue here. I've been gratefully rea
Electronics Forum | Fri Oct 16 16:11:52 EDT 1998 | Joe Belmonte
| | Hi Folks, | | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your proc
Electronics Forum | Mon Sep 21 21:21:32 EDT 1998 | Steve Gregory
| am working on the design of a showboard to demonstrate our | assembly capabilities. we are working with double sided assemblies involving BGAs and CSPs. could someone suggest | types of BGAs/ CSPs (type, name, I/O, etc)that would be a challenge t
Electronics Forum | Fri May 22 13:14:42 EDT 1998 | Earl Moon
| | | | Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has rece
Electronics Forum | Thu Nov 19 09:32:52 EST 1998 | Earl Moon
| | | | | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wav
Electronics Forum | Thu Nov 19 09:55:47 EST 1998 | Dave F
| | | | | | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the w
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
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