Electronics Forum | Tue Mar 11 10:19:00 EST 2003 | yngwie
We ran doublesided SMT thru Glue and Wave process before and but faced a lot of skip solder. Then the customer told us that they have similar problem when they ran the board so what they did was they print the paste-dispense the glue- place the comp
Electronics Forum | Fri Mar 28 21:43:57 EST 2003 | MA/NY DDave
Hi Yes to your stone question. This pretty much goes with any flux change. Yes to the proper solvent for the flux you choose. Check with the Kester Data Sheets. Kester should have some application sheets which include some No-Clean information.
Electronics Forum | Thu Mar 13 15:13:17 EST 2003 | ruggi
That's a good idea...and to add on to it, you could wash after the wave, too--it really doesn't matter. A question about this though--unless your Customer specifically requires "clean", no-clean flux whether it's ugly or not, is permitted by IPC,
Electronics Forum | Tue Mar 11 11:22:38 EST 2003 | slthomas
Is a water-soluble flux based paste an option for the bottom side? Then you could wash the residues from the board before wave. That's the only way we've tried that process. The difficulty we had was with some disturbed joints, apparently from s
Electronics Forum | Fri Mar 28 13:12:10 EST 2003 | barryg
We are going to be using a no-clean paste (smt)and no clean wave solder flux on a small pcb we will be doing here soon. As far as the wave process, should i purchase a new fluxer stone for the no-clean. Should I also purchse the recommended thinner o
Electronics Forum | Fri Mar 28 21:54:54 EST 2003 | MA/NY DDave
Hi Notice they do call out that you should use their thinner. In the MSDS you get a clue as to the thinner they are mostly using with some additives. http://www.kester.com/PDF%20FILES/PDF%20Data%20Sheets/E%20No-Clean%20Fluxes/951%20(30Mar98)logo.p
Electronics Forum | Thu Apr 01 09:10:55 EST 2004 | cyclopsn
We are currently using non clean paste and non clean flux in our manufacturing process. But recently our customer feedback that using a non clean process might cause flux blockage in via hole area and potentially might burn or explode the boards over
Electronics Forum | Mon Jun 01 21:40:18 EDT 2009 | kircchoffs
i need some inputs regarding this process. is this really eliminates voids and other solderability issues on BGA's?
Electronics Forum | Thu Jun 04 19:53:44 EDT 2009 | davef
For low volume work and repair, just use a brush dipped in tacky flux to apply flux to the ball array.
Electronics Forum | Fri Apr 02 00:16:18 EST 2004 | Mike Konrad
There is no shortage of reasons to clean your boards. Soldering or reflowing your boards leaves �stuff� on them. This �stuff� is normally corrosive and conductive (some fluxes / pastes are more corrosive / conductive than others). In either case,
