Electronics Forum | Fri Oct 03 07:49:18 EDT 2003 | mk
Mask Musings. Soldermask (SM) and its functions have changed and evolved over the years. As an ex-solder mask applicator, I can remember screening Colonial High Gloss Epoxy soldermask on boards back in the early 80's, ending up with a thickness that
Electronics Forum | Wed Oct 01 22:15:36 EDT 2003 | davef
Tough to say. It depends on the type of solder mask, the producer of the solder mask, and your board fabricators' process. As one angle on this, solder mask type affects thickness. Minimum clearance: * Liquid photoimageable: 2 thou * Screened liq
Electronics Forum | Tue Feb 10 13:59:29 EST 2004 | Vadim
At times the orange peel effect can be from excess flux improperly removed. Our company strictly provides the service of selctive conformal coating application. We quite often see this. Most times if the board is simply "water washed", or IPA washed,
Electronics Forum | Tue Feb 10 14:02:03 EST 2004 | Maryann
At times the orange peel effect can be from excess flux improperly removed. Our company strictly provides the service of selctive conformal coating application. We quite often see this. Most times if the board is simply "water washed", or IPA washed,
Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Electronics Forum | Thu Sep 11 16:50:18 EDT 2003 | davef
Sure it's conceivable that thin HASL can cause tombstoning. Harkening back to the ample discussion in the fine SMTnet Archives, tombstoning is caused by an imbalance in solder surface tension between the two pads of SMT component. The source of thi
Electronics Forum | Wed Dec 01 15:53:59 EST 2004 | davef
uV light inspection indicates the "completeness" of coverage, but provides no measurement of coating thickness.
Electronics Forum | Thu Nov 23 06:05:24 EST 2006 | 1B73
The solid content of 1B73 is too low, especiall when you add large amount of thinner, not easy to get enough coating thickness.
Electronics Forum | Mon May 18 13:30:15 EDT 1998 | Earl Moon
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
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