Electronics Forum: mechanical failure (Page 1 of 15)

Re: BGA solder joints versus mechanical stresses

Electronics Forum | Thu Sep 02 16:06:33 EDT 1999 | Earl Moon

| Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | What I'm really after is anything describing how close a screw/washer/nut combination

Re: BGA solder joints versus mechanical stresses

Electronics Forum | Thu Sep 02 16:37:23 EDT 1999 | R Scheller

| | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | What I'm really after is anything describing how close a screw/washer/nut combin

Re: BGA solder joints versus mechanical stresses

Electronics Forum | Thu Sep 02 16:52:31 EDT 1999 | Earl Moon

| | | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | | | What I'm really after is anything describing how close a screw/washer/nut

MELF component/solder failure

Electronics Forum | Tue May 06 14:52:37 EDT 2003 | bremerg

Pictures are now located at http://www.stevezeva.homestead.com/ These components are 2W resistors that only see 1/2W at max. during normal use. I have contacted IRC still wqaiting for a response. The resistors were tested as good. But the circuit

Mydata TP11 UFP hardware initiation failure

Electronics Forum | Wed Jul 26 15:28:11 EDT 2006 | RLM

How does the machine sense that the fan is working/not working? The fan may be operational but the sense mechanism may be at fault.

what are the main diffrences in failure modes for Bga

Electronics Forum | Sat Jul 05 14:07:33 EDT 2008 | shellydhami

Main diffrences in failure modes for mechanically and thermally induced BGA solder joint fracture

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Wed Aug 22 12:44:26 EDT 2012 | rway

I would look at your de-paneling process. How are you cutting the boards? This could be inducing mechanical stress on the component; especially if the part is close to the edge of the pcb and perpendicular to it.

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Wed Aug 22 13:16:23 EDT 2012 | rway

Most likely the depaneling is not your issue, but I do concur that there is some mechanical stress occurring somewhere. What about any fixturing for FT/ICT?

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Mon Aug 27 04:13:49 EDT 2012 | thmeier

Moisture should not be an issue with ceramics, but mechanical or thermal stress definitely is. Has there been rework on this capacitors? So check for handling /temperature of your soldering irons (better:use hot air). Check oven temperature/profile

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Fri Jul 27 12:21:18 EDT 2012 | tpatrickwalsh

I am posting this here because I think it may have something to do with PCBA: I have a simple battery-powered consumer product (LED light) that we have been manufacturing for some time. All of a sudden in one batch, we have about a 4% rate of a sing

  1 2 3 4 5 6 7 8 9 10 Next

mechanical failure searches for Companies, Equipment, Machines, Suppliers & Information

2024 Eptac IPC Certification Training Schedule

Wave Soldering 101 Training Course
One stop service for all SMT and PCB needs

World's Best Reflow Oven Customizable for Unique Applications
2024 Eptac IPC Certification Training Schedule

Stencil Printing 101 Training Course
PCB separator

Thermal Transfer Materials.