Over the past several years, post-reflow defluxing of circuit assemblies has gained in popularity. Microminiaturization of components and boards, combined with higher expected reliability and increased product liability, have contributed to the prominence of defluxing. Lead-free solder paste - with its higher reflow temperatures and negative effects on flux - increase ...
Why identify flux residues? The primary purpose of flux is to reduce species of metal oxides from solderable surfaces, and to act as a mechanism for lifting and removing debris. If the assembly is not properly cleaned after manufacturing, flux may continue to reduce metals and may eventually corrode the assembly. When the assembly is powered, the metal ions may...
Failure analysis (FA), by its very nature, is needed only when things goawry. Before any testing is performed on the sample, a decision mustbe made as to whether or not the sample is allowed to be destroyedin the process of testing. Non-destructive testing can allow for re-use of the assembly since the functionality is not altered, but there still remains the possibility ...
Over the last few years, there has been an increase in the evaluation and use of halogen-free soldering materials. In addition, there has been increased scrutiny into the level of halogens and refinement of the definition and testing of halogen-free solde
Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM 650 2.3.25, was established to enable monitoring of ionic contamination within series production. The testing procedure was successfully implemented within the production of high reliability, safety critical electronic circuits, involving multiple ...
Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause ...
High Mass Board Reflow Oven Recommendation -- We produce some heavy copper multi-layer boards. 4-6 layer typ with 3oz throughout. WE currently are using a Heller 1912EXL with belt speed around 32-36 in/min. I am looking to replace this oven with a more efficient unit. To the best of my knowledge only BTU and Vitronic will fit the bill. What would you all recommend?
Views: 431
Throiugh Hole pad missing after selective soldering -- Hello! We have a strange effect. Some pads of big trough-hole DDR slot just dessapear. Initialy it was soldered with selective soldering process (leaded, 290 degrees, ImSn finish, very short storage). Then some connectors with poor barrel fill we have try to rework with the same selective solderig with addional flux and a bit higher temperature. Afte that at looks like pads was washed away complitly, or dramaticaly decreas in size down to size of through hole. Is it possible that due to overheat, poor pcb quality or by some other reason soldering pad was complitely detached from throuh hole and blow away with a solder? This is quite big multilayer motherboard, that's why we try to make a rework with selective soldering machine, not with soldering station. Boards was prechecked, no issues with lifted lends etc...
The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, 11100 Johns Hopkins Road, Laurel, MD 20723, on Tuesday, May 24th.... | SMTA
MIRTEC will premier its line of 3D AOI and SPI Inspection Systems Hall 4A, Stand 128 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg.... | MIRTEC Corporation
FEATURING | A leading Electronics Manufacturing company, World Equipment Source. Explore over 60 lots all running and maintained by our in-house staff of engineers and technicians.
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.