Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness. Due to the various advantages ...
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures. For soldering processes the only way that temperatures can be substantially reduced is by using solders with lower melting points. Because of constraints of toxicity, cost and performance, the number of alloys that can be used for electronics assembly is limited and the best prospects appear to be those based around the eutectic in the Bi-Sn system, which ...
Voids affect the thermal characteristics and mechanical properties of a solder joint, thereby affecting the reliability of the solder interconnect. The automotive sector in particular is requiring the mitigation of solder voids in various electronic control modules to the minimum possible level. Earlier research efforts performed to decrease voids involved varying the reflow profile, paste deposit, paste alloy composition, stencil aperture, and thickness.
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then ...
Strange reaction with Selective Solder alloy -- A while back, we had a yellow coating showing up on some solder joints at Selective Solder (LEAD alloy). I contacted the company for our machine and he looked into it. One change we had made not too long before is we switched from Superior 75 to Superior 515 flux for cleaning nozzles. But that doesn't really explain how the yellow stuff got on the board. Now the problem has cropped up again. We had a few boards showing a yellow substance on the joints roughly 24 hours after soldering. We also did a big cleaning and re-tinning of nozzles, which involves soaking them in the Superior flux and then re-tinning them. Some of the soaked nozzles didn't get tinned yesterday, and they also show signs of yellow. The LEAD FREE nozzles did not. So I am thinking that the Superior 515 is somehow reacting to the LEAD alloy. Has anyone experienced this or can shed some light on it?
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cutting shrink tube -- We cut a lot of heat shrink tubing to length by hand. It is mainly short pieces up to a few inches. Size goes up to 3/4" or so. We currently us a paper cutter. What machines can any of you recommend? We would prefer something serviceable with easy to obtain spares. Thanks!
ZESTRON is pleased to announce that it will host "Defluxing of Copper Pillar Bumped Flip-Chips" on Tuesday, April 26th, from 11:00 AM to 12:00 PM EST.... | ZESTRON
RWT-1000 is used to treat rinsed DI water from PCBA cleaning machine which makes DI water reuse and discharge reaches local environment laws. RWT-1000 is an .... | HJS Automation International Limited
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.