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SMTnet Express August 29, 2013, Subscribers: 26233, Members: Companies: 13474, Users: 35110

Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

by Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland; Agilent

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established.

Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days...

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Forum search results for related keywords: Pb-free solder , Ni/Au, intermetallic compound, Sn-Ag-Cu

S-922N-LED
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System for LED cavity encapsulation...

by: Asymtek

VIGON® N 600
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by: ZESTRON

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SM471 Flexible High
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Chip mounting speed of 75,000 CPH...

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MTS500 Condor Flying Probe Tester

Fixtureless design, maximum flexibility...

by: Digitaltest

SP700avi
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SP700avi Inline Stencil Printer

Utilising the most advanced drive...

by: Speedprint

MV-9 Series
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Exclusive 15 Mpx ISIS Vision System...

by: Mirtec

Mark5 Series -
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The Mark III Reflow System

Up to 40% reduction in nitrogen consumption...

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Jabil - Surplus Equipment to Ongoing Operations

DEK 265 Horizon 02 Screen Printer, Fuji CP 742E Chipshooter and more...

September 9 - 10 | auction by: X-Line Asset Management

Orbotech VT-S22
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IBE SMT Equipment

all marketplace listings

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PPM

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Fuji NXT M3s, M6s
Chipshooters
Fuji Chipshooters

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MPM AP 25 HiE
Screen Printer
MPM AP 25 HiE Screen Print

Robo-Tek

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productronica 2013
- 20th International Trade Fair
November 12-15 | by: Messe Munchen

Find the entire value chain for electronics production in the leading international trade fair.

Cleaning, Testing and Reliability Workshop
- Free Online Webinar
September 10 | by: ZESTRON

A guide to best practices on PCB cleaning, failure mechanisms, solder paste challenges, surface analytics, PCB test techniques, and low cost solutions.

Jobs:

Business/Pricing Analyst

Austin, TX, USA | Nordson ASYMTEK

SMT Programmer/Lead

Franksville, WI, USA | BEI Electronics,LLC

Senior SMA Process Engineer

Lynchburg, VA, USA | AMTI Advanced Manufacturing

Resumes:

Customer Service Engineer

Suzhou, China

SMT Engineer

Chennai, India

SMT Test Ebgineer

Pune, India

Industry Associations Events

SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore

Next Event: Webinar: Free Webinar: High Reliability and RoHS - September 17

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: electronica India 2013 - September 4 - 6

Technical Editor - Davef (submit your technical articles)

Newsletter Editor - Anna Girouard

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