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3D ICs With TSVs - Design Challenges And Requirements

3D ICs As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up to 3D ICs with through-silicon vias (TSVs). 3D ICs promise "more than Moore" integration by packing a great deal of functionality into small form factors, while improving performance and reducing costs.

3D IC packages may accommodate multiple heterogeneous die-such as logic, memory, analog, RF, and micro-electrical mechanical systems (MEMS)-at different process nodes, such as 28nm for high-speed logic and 130nm for analog. This provides an alternative to system-on-chip (SoC) integration, potentially postponing an expensive move to a new process node for all of the functionality developers want to place in a single package.

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Source:

Cadence Design Systems, Inc.

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Featured New Products

The Mark III

Reflow System

Lead free certified, maintenance free system with lowest nitrogen and electrical usage... »»

Offered by: Heller

MC684

Pick & Place System

4-Head dual - gantry machine with placement speed of 10,500 cph! Dual smart feeder trolleys »»

Offered by: Manncorp

ProntoTEST-FIXTURE

ATE, MDA Software.

Designs the "bed of nails" test fixture and generates circuit description files your ATE... »» Download Trial

Offered by: Unisoft

Featured auction

Online Auctions | X-Line Asset Management

Qualcon, Flowery Branch, GA

December 15 - 16 | Location of Assets: USA

Complete Closure of SMT and Test Facility...»»

Jabil, Malaysia

December 20 | Location of Assets: Malaysia

Surplus SMT Equipment...»»

Visit the Equipment Auctions Calendar...

For Sale Online

CoolCap™ and CoolShield™ Thermal Protection

First product designed and developed specifically to protect adjacent IC components from excessive heat during printed circuit board rework or repair.

Compatible with both Tin-Lead and Lead-Free solder rework.

Visit Used Equipment Mart... Post Your Equipment Listing Free...

Forum

Air Moisture in Production | Posted by F�nsi

Because of the cold weather, we had some troubles with drying out of printed solder paste on the pcb's. The relative humidity in the air declined below of 20%... »»

Solder height after reflow | Posted by JoshG

Can anyone tell me if there is a formula for finding the after reflow height of solder with no part attached? I have to print some pads that do not have any parts but there can not be more than 1.5mil of solder on the pad after reflow... »»

PCB & MSD Component baking oven | Posted by Lalith

We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature � we have to maintain up to 200�C & humidity � below 5%)... »»

More Forum Topics:	Visit the Forum... Have a Question? Ask for Free...
Mirtec info - This thread is to provide info for users of the Mirtec Machines...

Forum

IPC Conference on Printed Electronics: What Does It Mean For the Printed Circuit Board Industry?

Conference | Tue, Jan. 18 | Sponsored by: IPC

Industry estimates project that by the end of 2010, printed electronics will be 35 percent of a $1.92 billion printed, thin film and organic electronics market... »»

Internepcon Japan

Trade Show/Exhibition, Conference | Wed, Jan. 19 | Sponsored by: Reed Exhibitions

World's leading electronics manufacturing events for the design, fabrication, assembly, packaging and testing of printed circuits and electronic assemblies. Part of the global Nepcon series of events... »»

Cleaning Options & Cost in PCB Assembly

Online Webinar | Thu, Jan. 27 | Sponsored by: The SMART Group

The majority of the industry have been running no clean processes for many years and have often neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues... »»

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Career Center

Jobs:

SMT Process Technician

Cree, Inc.

Durham, NC, USA

Responsible for operation and maintenance of Solder Screen Printers, Pick & Place equipment... »»

SMT Technician

Magna Electronics

Holly, MI, USA

We are looking for individuals who have good knowledge with Universal equipment, DEK, and Vitronic ovens... »»

Manufacturing Engineer

AGILITY mfg

Dover, NH, USA

Looking for an experienced process engineer in the EMS industry. Primary attributes should be in the surface mount process, profiling, tooling, machine troubleshooting... »»

More Jobs:

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Resumes:

SMT Programmer / SMT Operator

Desired Field: Engineering, Technical Support

Romania

Always focused on results and have a solid experience in programming Universal SMT machines ... »»

SMT Board Assembly & Production Technician

Desired Field: Engineering, Production

Chennai, Tamil Nadu, India

Operation and maintenance of Panasonic mc,Heller Reflow Oven, Dek solder paste printer... »»

SMT Process and Maintenance Engineer...

Desired Field: Engineering

Juarez, Chihuahua, Mexico

I have more than 5 years of experience working at SMT and final assembly lines...»»

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Industry Associations Events

SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore

Next Event: Pan Pacific Microelectronics Symposium 2011 - Jan. 18

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: Market Update for the EMS Industry - Dec. 14

SMTnet Express
December 9, 2010

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