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Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

The purpose of this paper is to investigate the effects of reflow time, reflow peak temperature, thermal shock and thermal aging on the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC305) soldered joints.

Long-term reliability of solder interconnections depends on intermetallic compound (IMC) formation (Miric and Grusd, 1998). The IMC is necessary for a good solder interconnection and its presence gives a bonding layer between the bulk solder and component termination and/or board substrates. Solder joint reliability can be affected by both lack of an IMC layer and too thick an IMC layer. If a thick IMC layer was formed within the solder joint, its brittleness can cause solder joint reliability concerns.

Authors: Jianbiao Pan, Tzu-Chien Chou, Jasbir Bath, Dennis Willie, Brian J. Toleno

Company / Organization: California Polytechnic State University, IBM Taiwan, Bath Technical Consultancy,
Flextronics International, Henkel Technologies

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April 29, 2010

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