Process Development And Characterization Of The Stencil Printing Process For Small Apertures. The consumer�s interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability. Credit/Source: Dr. Rita Mohanty 
Westell Auction #2 - Complete Closure of SMT Operations
Fuji Chipshooters, MPM Printers, HP 3070, Vitronics Ovens, and More...
best instructors have put to video demonstrations of common hand soldering skills. these are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. rather they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while. 
Solder Paste Inspection Systems Posted by CL I am looking into solder paste inspection systems. I have used a solder paste height inspection system in the past. We have derived less than usefull information...»» Posted by Grant We need to solder a USB plug onto a PCB in our SMT machines, and this is the same type of plug you see on USB storage devices. It's a very flat connector... »» Affordable Inspection Microscopes? Posted by operator Does anyone have a good source for inspection microscopes? I want something with a lot of zoom. I want to be able to zoom in on one 0603 resitor joint... »» 
SMTA Anaheim Academy: Practical Innovations for 3D Packaging of ICs Seminar/Course | SMTA Tue, January 29, 2008 | Anaheim Convention Center, Anaheim, CA, USA Addressing System Level Integration and Miniaturization for Electronics. The participants will be able to explore a number of alternative package methodologies... »» BGA Componet Rework & Profiling Seminar/Course | Precision PCB Services, Inc Mon, January 21, 2008 | Oroville, CA, USA Students are taught methods for safe and reliable BGA component rework using a top of the line SRT BGA Rework System... »» Hands-On PLC Training Workshop Seminar/Course | Business Industrial Network Tue, January 22, 2008 | Microsoft Building, Saint Louis, MO, USA This course qualifies for CEU and attendees receive a certificate. Also a software simulation CD is provided so you can practice what you learn... »» 
In-circuit/functional test Team Leader Columbus, OH, USA Candidate should have experience with in-circuit and functional testing of PCB's, troubleshooting skils, and be able to supervise a team of approximatley 20 people... »» Lead Supplier Quality Engineer- Fluid Systems Schenectady, NY, USA Responsible for supplier quality for assigned Fluid Systems. Conduct process capability analyses for CTQs characteristics. Work with suppliers to improve process... »» Sugarland, TX, USA Creates programs using CircuitCAM, or manually, for Automated Placement, Inspection, and Test machines used in the manufacturing of printed circuit boards...»» 
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