A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750µm to the latest WL-CSPs demanding 250µm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies. Credit/Source: DEK, Steve Watkin, Tom Falcon 
Electronic Manufacturing Exchange #71
Digital oscilloscopes, spectrum, logic and network analyzers, generators, meters, counters, plug-ins, test sets, cards and much more.
BEST Instructors have put to video demonstrations of common hand soldering skills. These are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. Rather they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while. 
Posted by SWAG We just got a contract to build a board with 1400+ SMT placements. This thing is 16" x 12" and the PCB thickness is 0.142"...»» Posted by mpolak Could you guys verify my BTU VIP98N oven settings for lead free process. At the moment as my standard profile im using these settings... »» SMT/ PCT edge conveyor replacement belts... Posted by ehess Does anyone kbnow where I can find replacement belts for the old PCT (Process control Technologies) conveyors?... »» 
Seminar/Course | Precision PCB Services, Inc Mon, January 07, 2008 | Oroville, CA, USA In this two day course students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate... »» Conference | Heller Industries Inc. Thu, January 17, 2008 | Online Success Starts with the Right Profile. Join the leader in oven technology for the latest in thermal profiling information... »» Trade Show/Exhibition | Reed Exhibitions Japan Ltd. Wed, January 16, 2008 | Tokyo Big Sight, Tokyo, Japan Exhibition Featuring all Lines of Test, Inspection and Measurement Systems for SMT, IC Packaging and Board Manufacturing... »» 
Buffalo Grove, IL, USA Responsible to support sales and technical activities to maintain and acquire business with assigned accounts. Administrative support regarding account contracts...»» Neenah, WI, USA Responsible for providing technical support and training on all factory/site assembly production equipment. Individual may lead, train, and mentor lower level technicians...»» Schweitzer Engineering Laboratories Pullman, WA, USA The ideal candidate will be able to assist management to specify, evaluate, recommend and conduct acceptance tests on electronic assembly process equipment...»» 
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