Implementing Lead Free Soldering � European Consortium Research Credit/Source: Dr. M. Warwick Over the last ten years, there have been a large number of publications describing work into lead free electronics soldering. They have come from all regions of the world and from academic organisations, individual companies and consortia. Although a number of these studies have culminated in �production trials�, these have invariably been on a limited scale and they were essentially a demonstration, rather than the first step to implementation... 
Printed Circuit Board Equipment Exchange #8
State-of-the-Art PCB Manufacturing Equipment Printed Circuit Board Manufacturing Featuring Drilling & Routing, Lamination, Etching, Plating, Expore, Solder Mask, Final Test,plus SMT & Placement, Feeders, Reflow & Convection, Screen Printing and much more ELCOTEQ. PCB(A) Manufacturing Facility
Featuring: Complete High Speed Siemens SMT Facility 
ProntoPLACE used by electronics manufacturers will quickly program your surface mount SMT and thru-hole assembly equipment. Universal, Fuji, Mydata, Siemens, Panasonic, Philips, Contact Systems (CS400, etc.), Camelot, Quad assembly and others are supported. Also create create work and assembly instructions, etc. 
BEST Instructors have put to video demonstrations of common hand soldering skills. These are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. Rather they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while. 
Temperature Probes for Reflow Profiling Posted by pauld Any new alternatives to using temperature probes for characterizing reflow profiles? The mfg just doubled the price...»» Posted by Arun QFN assembled on a PCB indicates paramteric fails when tested. When the QFN on PCB is reflowed a second time, it recovers and passes testing... »» Wavesoldering capability study Posted by Reypal We plan to make capability study on our wave-soldering machine (...) My question is what we should consider most among the critical parameters?... »» 
Seminar/Course | Circuit Technology Inc Mon, July 16, 2007 | CTI Training Center, NC, USA This four day class is an in-depth study of the newest revision of the industry standard IPC-A-610 Revision D... »» Stencil Printing for Flip Chip Bumps Webinar Online Webinar | Speedline Technologies, Inc. Thu, July 19, 2007 | Online One technology used to create the bumps on flip chips is printing and reflowing solder paste. The solder paste is printed directly... »» STENCIL Technology and Design Workshop Seminar/Course | Photo Stencil Fri, July 27, 2007 | Photo Stencil Facility, Colorado Springs, CO, USA In this workshop you will have access to information on stencil printing performance and how stencil technology and stencil design influences stencil printing performance... »» 
Jobs: Columbus, OH, USA Minimum of 5 years experience processing and mold setting on Cincinnati Milacron Injection Molding Machines...»» Owings Mills, MD, USA The candidate would participate in product design phase reviews and interfaces with customers in supporting testability...»» Willow Grove, PA, USA A proven communicator, who may lack sales experience, but compensates by being success driven...»» Resumes: GenRad In-Circuit Test Engineer Desired Field: Maintenance... Philippines In-Circuit Test and Functional Test Fixture and Jigs local fabricator, and customers support on all ICT related issues...»» Desired Field: Engineering Tijuana, Mexico 7 years of experience in Manufacturing procesess and New Products Introduction of comercial and military SMT...»» Desired Field: Engineering, Production Mentor, OH, USA 6 years of experience in electronics. I know how to program, operate, maintain, setup SMT machines...»» 
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