FREE Keynote Presentation - Lean Transformation Process Leveraging the Power of Many H. Richard Schuler, Director of Lean Implementation, Integrated Defense Systems of Raytheon Wednesday, May 10: 9:00 am - 10:00 am
Richard Schuler, the Director of Lean Implementation at Raytheon Companys Integrated Air Defense Center in Andover Massachusetts will present the keynote address, Lean Transformation ProcessLeveraging the Power of Many, on Wednesday, May 10 at 11:00 am at the NEPCON East/Electro and Assembly East event. The co-located manufacturing shows will take place May 10 & 11 at the new Boston Convention and Exhibition Center in Boston Massachusetts.
NEPCON East/Electro and Assembly East Conference Programs.
These sessions will give you a broader knowledge of critical industry issues, increase your understanding of advanced technologies, and let you engage in dialog with industry colleagues.
Global manufacturer and supplier of desktop, in-line (AOI) automatic optical inspection, and real-time x-ray inspection equipment. Among the many strengths are the ease of programming and the flexibility to be used anywhere in the mfg. process.
MYDATA automation designs, manufactures and markets surface mount assembly machines. Its business mission is to satisfy the needs of the electronics industry for SMT equipment, while meeting its demands for flexibility and high quality production.
Wednesday May 10, 2005 10:00 am 12:00 pm WS-1 Kick Starting Lean Five Pitfalls to Avoid Bruce Hamilton, President of Greater Boston Manufacturing Partnership, Vice Chair - Business Board of Examiners for the Shingo Prize, Shingo Prize Recipient.
1:00 pm 3:00 pm WS-2 Unique Advantages to Lean in Assembly Pat Wardwell, Greater Boston Manufacturing Partnership, Continuous Improvement Manager, GBMP, Shingo Prize Winner and Board Examiner.
Thursday, May 11, 2006 10:00 am 12:00 pm WS-3 Organizing Assembly for More Effective Supervision Dan Fleming, Continuous Improvement Manager, Greater Boston Manufacturing Partnership (GBMP), Shingo Prize Board Examiner, GBMP.
1:00 pm 4:00 pm WS-4 Lean and Six Sigma Collaboration in Assembly Dave Sproul, Master Black Belt,Greater Boston Manufacturing Partnership (GBMP), Shingo Prize Board Examiner, GBMP.
Thursday, June 8, 2006 10:00 am 11:50 am CS-5 Designing Products for Cellular Assembly Tom Lawton, President, Advent Design.
1:00 pm 1:50 pm CS-6 Lean Deployment in an Electronics Manufacturing Services (EMS) company Robert Yenkner, Director Americas Lean Operations, Celestica Corporation.
2:00 pm 2:50 pm CS-7 Enabling Lean Six Sigma Manufacturing Assembly and Test Tony Cuilwik, President, CIMx.
Wednesday, May 10, 2006 10:00 am 10:50 am CS-1 Applications for Carbon Nanotubes Mike Foley, Cheap Tubes, Inc. President.
11:00 am 11:50 am CS-2 Electron Attachment: A New Approach to H2 Fluxless Solder Reflow for Wafer Bumping Dr. C. Christine Dong, Lead Research Scientist, Air Products and Chemicals, Inc.
Thursday, May 11, 2006 10:00 am 10:50 am CS-8 Why Electronics Packaging Design is More Important Than Ever James Bleck, President, Bleck Design Group.
11:00am 11:50 am CS-9 Screen Printable Polymers for Wafer Level Packaging: A Technology Assesment James Clayton, Polymer Assembly Technology, Inc. President & CEO.
The SMTA Boston Conference continues to provide you with information to help you stay on top of the latest changes in the industry. The 2006 program offers choices between full-day and half-day courses as well as two certification programs and a mini-conference that everyone should attend. Develop a curriculum to fit your own specific needs.
T1: SMT Process Fundamentals for Lead Free Assembly Manian Ramkumar, Rochester Institute of Technology Tuesday, May 9, 8:30 am - 5:00 pm.
T2: The Reality of Reliability of Pb-Free Craig Hillman, DfR Solutions Tuesday, May 9, 8:30 am - 5:00 pm.
T3: Manufacturing Reliable Lead-free Electronics with High Yield & Low Energy - What You Should Know Jennie Hwang, Ph.D., H-Technologies Group, Inc. Tuesday, May 9, 8:30 am - 5:00 pm.
T4: Failures and Their Prevention in Electronic Assemblies Viswam Puligandla, Ph.D. Wednesday, May 10, 8:30 am - 5:00 pm
T5: Flip Chip Assembly and Applications-What, Why, Which, and How George Riley, FlipChips Dot Com Wednesday, May 10, 8:30 am - 12:00 pm.
T7: Introduction to Six Sigma Tools in Reducing Process Variation Rita Mohanty, Speedline Technologies Thursday, May 11, 8:30 am - 5:00 pm.
T8: Advanced SMT Manufacturing - Equipment, Processes, and Practices Phil Zarrow, ITM Consulting Thursday, May 11, 8:30 am - 5:00 pm.
T9: Practical Considerations of Lead-Free Transition Chrys Shea, Cookson Electronics Thursday, May 11, 8:30 am - 12:00 pm.
T10: Advanced Reflow Oven Configuration and Profiling For Lead-Free Soldering Jim Hall, ITM Consulting Thursday, May 11, 1:30 pm - 5:00 pm.
SMTA BOSTON SPECIAL EVENTS Updated SMTA Mini-conference: Eleventh Hour RoHS-Compliance: Critical Issues and Best Practices Harvey Stone, The GoodBye Chain Group Wednesday, May 10, 8:30 am - 5:00 pm.
To Register for Conferences, Please Call Betty: 1-800-246-8371. or e-mail
Wednesday, May 10, 2006 CS-1 Applications for Carbon Nanotubes Mike Foley, Cheap Tubes, Inc. President 10:00 am 10:50 am.
CS-2 Electron Attachment: A New Approach to H2 Fluxless Solder Reflow for Wafer Bumping. Dr. C. Christine Dong, Lead Research Scientist, Air Products and Chemicals, Inc 11:00 am 11:50 am.
Thursday, May 11, 2006 CS-8 Why Electronics Packaging Design is More Important Than Ever James Bleck, President, Bleck Design Group 10:00 am 10:50 am.
CS-9:Screen Printable Polymers for Wafer Level Packaging: A Technology Assesment. James Clayton, Polymer Assembly Technology, Inc. President & CEO 11:00 am 11:50 am.
These sessions will give you a broader knowledge of critical industry issues, increase your understanding of advanced technologies, and let you engage in dialog with industry colleagues. And they are FREE with your complimentary exhibit hall registration.
FREE Keynote Presentation Lean Transformation Process Leveraging the Power of Many H. Richard Schuler, Director of Lean Implementation, Integrated Defense Systems of Raytheon Wednesday, May 10, 9:00 am - 10:00 am.
FREE Panel Discussion Where Does Design Fit in Today's Electronics Manufacturing? Moderated by Mike Buetow, Editor in Chief, Circuits Assembly Wednesday, May 10: 11:00 am - 12:00 pm.
Panelists: Gary Ferrari, Ferrari Technical Services Jeff Seeger, Applied CAD Knowledge Celestica representative.
FREE Panel Discussion Assembling for Military Electronics Moderated by Adam Cort, Associate Editor, Assembly Magazine Wednesday, May 10: 1:00 am - 2:00 pm.
Panelists: Eleanor Holland, Director, Small Business, Defense Logistics Agency - Electronics, Columbus, OH. Gary Cox, Pres., NavCom Defense Electronics, Inc. Warner Robbins, GA. Dave Williams, President, Sechan Electronics, Lititz, PA.
FREE Networking Ice Cream Social Wednesday, May 10: 3:00 pm - 4:00 pm. All attendees and exhibitors are invited to take an afternoon break for a complimentary ice cream sundae right on the show floor. Just visit the Sundae Carts in the back of both halls.
FREE Panel Discussion Thursday May 11. Implementing Lean: Successes and Failures. Moderated by Bruce Hamilton, President of Greater Boston Manufacturing Partnership, Shingo Prize Recipient, Vice Chair - Business Board of Examiners for the Shingo Prize.
Panelists: Dave Cooper, North Atlantic Corporation, Research and Development Matt Mercer, IDS Operations, Raytheon Mike Vogel, Director of Operations, Z Corporation Robert Yenkner, Director Americas Lean Operations, Celestica.
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