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SMT Express, Volume 5, Issue No. 7 - from SMTnet.com

Aligning the design and supply chains
Component selection is often based on design and technology needs alone, with little thought given to downstream supply chain/manufacturing concerns. This can result in serious and costly problems that can be avoided with good business processes.

Posted by Design Chain Associates, LLC

How to Select the Best Stencil for SMT and Advanced IC Package Printing
The stencil selection process can be confusing, particularly when creating a stencil for a new application. This tutorial, which covers stencils for SMT and advanced IC packaging applications, offers guidelines to assist users in stencil selection and print optimization.

Posted by Peter Carry

Volume 5, Issue No. 7
June 18, 2003

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Agilent Technologies Receives Award
Frost & Sullivan's 2003 Product Line Award

Lectronix Receives Certifications
ISO/TS 16949:2002 and ISO9001: 2000 Certifications

CirTran New Business Order Trend
YTD Orders From New Customers Have Exceeded $1M

Mentor Acquires Assets of DDE_EDA
Accelerates Delivery of Advanced Packaging Capabilities

Sanmina-SCI's Wilmington PCB Plant Certified
Facility Achieves Military Qualification

Arrow Electronics Announces Restructuring Plans
Continues To Improve Operating Efficiencies

Withdrawal of Nam Tai's Registration Statement
Cites the Effect of SARS on Stock Market

NEC Electronics Appoints Corporate Auditor
Yasuo Matoi Appointed As New Corporate Auditor

DuPont Appoints Insulectro as National Distributor
For DuPont Electronic Technologies Circuit Materials

NEMI's Test Strategy Project
Manufacturing Test Strategy Cost Model Released

Phoenix Contact Introduces New Power Connectors
Power Connectors Bring Heavy Cables Onboard

Mentor Graphics Unveils Design Tool Flow
Addresses Challenges of Designing Complex FPGAs

Allegro MicroSystems Offers New SG Package
Package Provides Integrated Hall-effect Solution

DuPont Price Increase for Riston��
Price Increase of 4 to 7 Percent

Spray Stencil Cleaners from Smart Sonic
Now More Effective and Environmentally Safe

Vicor Unveils V��I Chip Bus Converters
consists of 48V to 12V Bus Converter Modules

SQC in Electronics Manufacturing
NWA Quality Analyst Softwear Applications

Vishay Siliconix Monolithic Dual JFETs
Eliminate Latch-Up In Amplifier Designs

DMI International's Universal Overhead Top Hat
Adaptive Tool Prevents Components Floating Off

DEK and PacTech Join Forces
High-Volume Wafer Bumping Solution

Virtex-II FPGA Prototyping Boards
FPGA Design Evaluation & Testing

More News

VOC-Free Liquid Flux Development
Minimum Defects and Lead-free Wave Soldering Compatibility
From Circuits Assembly

The Way We See It
China Not 'Immune' to Manufacturing Challenges
From CircuiTree

The Plating Rack
Drilling to the Source of Voids
From Printed Circuit Design and Manufacture

Reworking Plastic
And Other Heat-sensitive Components
From SMT Magazine

Speeding Up the Conversion Period
Making the Change to Lead-Free Products
From EP&P

Electronics Assembly
Soldering Soldiers
From Assembly Magazine

North American Market Improving
SARS Scrambling Global Picture
From PCB 007

Electrovert OmniFlo 10E
Posted by Digital Technologies

Smartsonic or Similar Ultrasonic Stencil Cleaner
Wanted by Pro-Con Technologies

Conceptronics HVA102r(FF) Reflow Oven
Posted by Global Technology Trading

Visit the Mart

Moisture free storage units.
Posted by John Luckham
I am looking for information concerning desiccator cabinets...

Automation Equipment Registration Fees
Posted by Jason Gregory
We have been informed that the mfr. will no longer support the equipment without us first paying a registration fee. This I can understand, however... We are being told we have to pay 3k for EACH machine!!!!!!

Wave soldering profiling
Posted by Frank
I was wondering if there is a profile with respect to wave soldering? Is there a document I can refer to get this information?

BGA inspection scope - Visual
Posted by Tellinghuisen
Does anybody have any experiences with this type or equipment? (i.e. ERSAscopes like contraptions)

Visit the Forum

Optimizing HALT, ESS and HASS
June 23-25, 2003

IPC Designer Certification
June 24-25, 2003

International Conference on Composite Materials
July 14-18, 2003

Visit the Calendar

Benchmark Electronics Elects Board Member
John Cox Appointed to the Board of Directors

Electro Scientific Industries Executive Termination
ESI Terminates CEO James Dooley

SMTEK Appoints Two New Board Members
Edward Smith and Robert Howard to Fill Vacancies

Director of Global Services Named at Universal
Announces the Appointment of Bob Lamanna

Sales Director
Company: Reptron Manufacturing
Location: Michigan

Software Engineer
Company: Aegis Industrial Software
Location: Pennsylvania

SMT Process Engineer
Company: Autosplice
Location: Tijuana, Mexico

Sales & Marketing
Company: SMTnet
Location: Maine

International Free Workshops
Two Half-day Workshops

Call for Participation
Announces Pan Pacific Symposium

International Update
Will Feature Seventeen New Courses

International Announcement
Opening Session and Annual Meeting Announced

International Announces Upcoming Events
Special Symposiums and Emerging Technologies Summit

IPC Announces Victory
Triumph Over EPA's Guidelines

IPC Releases New Tools
Release of Three Diverse Industry Products

IPC Government Relations
Industry Score Another Victory

IPC, HKPCA Reschedule Exhibition
Intl. Printed Circuit and Electronics Assembly Fair Rescheduled

IPC Book-to-Bill Ratio
IMS/PCB Business Report

IPC Updates Two Test Documents
Revised Standards on Solderability

SMTnet Express is a bi-monthly publication of SMTnet.com
Direct inquiries and comments to SMTnet
tel: 207-780-0887

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