2k filling and spraying glue AB thermally dispensing system glue dispensing robot machine

2k filling and spraying glue AB thermally dispensing system glue dispensing robot machine Description:

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2k filling and spraying glue AB thermally dispensing system glue dispensing robot machine

| Dispensing machine | Potting machine | Two components metering, mixing & dispensing machine | Vacuum potting machine | Epoxy potting machine | Adhesive dispensing machine | UV adhesive machine |  Resin Transfer Molding machine | Foaming dispensing machine | High viscosity resin supply pump | Silicone Sealing machine | Liquid Silicone Rubber dispensing system | Micro screw pump | Two-components screw pump | Custom-Made metering, mixing & dispensing system |

Out system features include:

• Heating Function
• Auto cleaning mixing nozzle Function
• Vacuum function for degassing bubble
• Auto feeding pump for filling the resin from customer tank to our machine bracket
• Key parts of the equipment are made of highly wear-resistant materials to reduce the number of maintenance times.
• Anti-precipitation stirring function in storage tanks.
• Easily set AB glue mixing ratio to meet various application requirements.
• Other custom-option for various applications.
• Tank level sensor
• Dynamic/static mixing motor for optional

two-component resin automatic metering/mixing/dispensing machine. This system is using servo motors, high-precision metering valves and PLC control mode and this is specially designed for low and medium viscosity resins. (such as epoxies, urethanes, silicones and acrylics)

Feature

• Logical operation function
• Various parameter settings
• Manual testing of various components
• Mixing ratio monitoring and adjustment
• Can store multiple sets of operating programs
• Material output pressure detectors
• Low level alarm of pressure storage barrel

Dispensing one or two components’ materials in the object to enhance the products waterproof, heat conduction, Confidentiality protection, insulation between wire and etc.

“Accurate mixing ratio” and “Mixing uniform” are the most important point in two or multi components potting system.

1. Accurate mixing ratio
   Through a PLC control system and HMI touch screen, Our automatic potting system provide the reliable output volume repeatability in a different mixing ratio. Meanwhile, our systems are equipped with many monitors unit to detect the output volume in real time.
2. Mixing uniform
   According to the user materials viscosity and mixing ratio, we provide the suitable mixing unit planning and we have static or dynamic mixing valve to choose.

Our system is suitable for potting of abrasive and high-viscosity materials in PCB, Electric parts, Motors, EV motors, LED and others applications. We specialize in providing solutions for high viscosity materials supplying.

What is the difference between potting, casting and encapsulating in electronics processing?

An encapsulate or potting compound is a liquid resin system comprised of either one or two components that is poured over electrical and electronic components or circuit boards.

These encapsulating resins are designed for a variety of applications to protect the product including electrical insulation, environmental protection from moisture, water and chemicals and mechanical attack from thermal shock and vibration. This protection allows these electronics to be used in many more applications ensuring reliable, long-term performance.

This process can be done by several methods: potting, casting and encapsulation. Many names have been used interchangeably so there is some confusion of the terms. The most commonly used term is encapsulation or potting. The definitions mostly used in the industry is as follows:

Potting

The potting method uses a “pot” or case or shell to put the device in and then pour the liquid potting compound to the top of the case covering the device and completely encasing it. The case becomes part of the finished unit. This is the most common method used, especially for high speed and many-units-per-hour production-line conditions.

Casting

The casting method is the same idea but instead of a case that stays apart of the unit a mold is use and removed after the potting compound has hardened. Sometimes this is also referred to as encapsulation. This is used when a molded unit is desired.

Encapsulation

The encapsulation method is also referred to when a device is dipped into a resin system and a thick coating completely surrounds the unit. Sometimes this is just called a “dip coating”. Molded device is a normally described as an encapsulated unit.