PCB Cross-Sectional Analysis

PCB Cross-Sectional Analysis Description:

Cross sectioning is also known as dissection and micro sectioning. It entails cutting a circuit board to retrieve an area of interest, potting the targeted item in epoxy, and grinding/polishing to a particular plane in order to see internal features of the circuit board, solder joint, or component.

Cross sectioning is done as part of component replacement studies, problem diagnostics, field failure studies, product characterization, production issue studies, solder joint crack detection, void measurement, via examination, plate thickness measurement, and PCB evaluation.  For example, automotive companies require DV and PV thermal cycle testing that tends to create fatigue cracks in solder joints; cross sectioning is performed to identify and measure those cracks.