Wafer Pick and Place Machine HJC-560
Company Information:
Name: |
Wafer Pick and Place Machine HJC-560 |
Category: |
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Offered by: |
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Wafer Pick and Place Machine HJC-560 Description:
- Can be used with 6-inch to 12 inch Wafer disk;
- Compatible with JEDEC standard, 350 × 200 × 20 (mm) and below;
- The standard nozzle can be quickly replaced according to the size of the product;
- For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die;
- Suitable for QFN, CSP, Flip chip/die.
Category: Wafer Pick&PlaceTags: die with blue tape pick and place, wafer pick and place
https://www.hjsautomation.com/product/wafer-pick-and-place-machine-hjc-560/
Features:
- Can be used with 6-inch to 12 inch Wafer disk;
- Compatible with JEDEC standard, 350 × 200 × 20 (mm) and below;
- The standard nozzle can be quickly replaced according to the size of the product;
- For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die;
- Suitable for QFN, CSP, Flip chip/die.
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Contents |
Parameters |
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Machine overall size |
1300×1200×1650 (L×W×H) |
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Input voltage |
AC 220V 50Hz |
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Maximum power |
3KW |
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Weight |
800KG |
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Input air supply pressure |
0.4~0.7 Mpa |
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Air pressure consumption |
≈50~120L/min |
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UPH |
≥2000Pcs/H (CT≥1.2 S) |
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Swing yield |
≥99％ |
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Mechanism positioning accuracy |
XY axis ± 0.01mm, rotation axis ± 0.05 ° |
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Operation mode |
Manual loading and unloading, automatic reclaiming and swinging |
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Material conveying mode |
Linear motor |
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Control mode |
Integrated control |
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Startup mode |
Button start |
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Parameter setting mode |
Screen settings |
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Abnormal alarm mode |
Buzzer+screen display+three color indicato |
Wafer Pick and Place Machine HJC-560 was added in Jan 2023
Wafer Pick and Place Machine HJC-560 has been viewed 109 times
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