MacDermid, Inc.

PCB/Substrate Finishing Overview

Jan 06, 2023 | John Swanson

PCB/Substrate Finishing Overview - iNEMI - PCB Surface Finish Overview. Surface Finish deployment ranked by surface area. OSP greatest. Imm Tin. ENIG. Silver. ENEPIG....

ACHIEVING A SUCCESSFUL ENIG FINISHED PCB UNDER REVISION A OF IPC 4552 MACDERMID ENTHONE

Jan 06, 2023 | Martin Bunce, Lenora Clark, John Swanson

The 4-14 IPC Standards Committee recently created a revision to the IPC4552 specification for Electroless Nickel/Immersion Gold (ENIG) finished Printed Circuit Boards (PCB). Revision A brings a more comprehensive evaluation of metal layer thicknesses measurement, composition and introduces, for the first time, a quality aspect for nickel corrosion which has been historically connected to a defect called black line nickel or black pad....

Effects Of Surface Finish On High Frequency Signal Loss Using Various Substrate Materials

Jul 06, 2021 | Don Cullen, Bruce Kline, Gary Moderhock, Larry Gatewood

The amount of information transferred on wireless networks has increased dramatically with the tremendous growth of mobile phones, Internet access, and hand held devices. In order to build the infrastructure needed to handle ever increasing data transfer, manufacturers of electronic devices turn to high speed, high frequency electronic signals. The need to render these electronic devices portable is another technology driver. The merge of high-frequency signals with small geometry conductive traces means that the topic of signal loss has reached a critical point in existing device production....