BGA Assembly

BGA Assembly Description:

PCBMay Provides BGA assembly, SMT assembly and Turnkey PCB assembly services with extensive experience and knowledge. Ball Grid Array is an important type of surface-mount packaging employed in integrated circuit boards. Ball Grid Array essentially used for mounting high-performance devices including microprocessors. BGA assembly Implemented with advanced manufacturing and inspection equipment, we can produce high-quality BGA Assembly Board with excellent proceeds rates.

What is BGA Assembly

The Ball Grid Array or BGA is one of the encapsulation methods used to connect components in integrated circuits.With a large number of pins,the BGA Assembly makes the connection by welding small balls with direct fixation between component and plate. 

It is one of the most critical encapsulations of the process and requires extra care during assembly,as without the aid of radiological equipment,it is possible to inspect only the external balls of the component.