Vapor SUI Clean

Vapor SUI Clean Description:

Cleaning Application:

• Cleaning after die bond
• Cleaning of 3D package
• Micro-standoff precisely cleaning
• SIP and microwave assembly cleaning
• Cleaning before chip packaging
• Cleaning before PCBA coating
• Cleaning electronic assemblies with low stand-off,such as: FC,BGA,CSP,BTC,QFN,MELF;
• Apply for assemblies of water-free cleaning
• Factory which doesn’t permit wastewater discharge.

Unique Advantage:

• The third-generation vapor cleaning technology with two types of co-solvent.
• Unique double flow cleaning technology ---- “SUI”,which with high flow spray under immersion sump up to 500L/min.
• Spray under immersion+bubbling+vertically oscillated of basket, even no ultrasonic to achieve perfect cleaning result.(132Hz ultrasonic cleaning optional)
• Waterfree cleaning process is apply for cleaning after die bond,which can rinse the organics thoroughly.
• Multi-cycles vapor rinse to improve flexibility of cleaning process.
• Double refrigeration system+ Double-seal technology, strictly control the volatilization of solvent, no harm to operator and environment friendly.
• Cleaning process can be set flexibly according to cleaning application.
• Wide range of customized basket and fixture.