Panasonic SMT Chip Mounter Npm-D3 Placement Machine
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Panasonic SMT Chip Mounter Npm-D3 Placement Machine |
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Panasonic SMT Chip Mounter Npm-D3 Placement Machine Description:
SFG Electronic Technology Co.,Limited
Contact:Andy Tung
Cell Phone/WhatsApp/Wechat:+86 13751093139
Skype:kelvin-andy
| Model ID | NPM-D3 | |||||
| Rear head Front head |
Lightweight 16-nozzle head | 12-nozzle head | 8-nozzle head | 2-nozzle head | Dispensing head | No head |
| Lightweight 16-nozzle head | NM-EJM6D | NM-EJM6D-MD | NM-EJM6D | |||
| 12-nozzle head | ||||||
| 8-nozzle head | ||||||
| 2-nozzle head | ||||||
| Dispensing head | NM-EJM6D-MD | NM-EJM6D-D | ||||
| Inspection head | NM-EJM6D-MA | NM-EJM6D-A | ||||
| No head | NM-EJM6D | NM-EJM6D-D | ||||
| PCB dimensions*1 (mm) | Dual-lane mode | L 50 x W 50 ~ L 510 x W 300 |
| Single-lane mode | L 50 x W 50 ~ L 510 x W 590 | |
| PCB exchange time | Dual-lane mode | 0 s* *No 0s when cycle time is 3.6 s or less |
| Single-lane mode | 3.6 s* *When selecting short conveyors | |
| Electric source | 3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA | |
| Pneumatic source *2 | 0.5 MPa, 100 L /min (A.N.R.) | |
| Dimensions *2 (mm) | W 832 x D 2 652 *3 x H 1 444 *4 | |
| Mass | 1 680 kg (Only for main body:This differs depending on the option configuration.) | |
| Placement head | Lightweight 16-nozzle head (Per head) |
12-nozzle head (Per head) |
8-nozzle head (Per head) |
2-nozzle head (Per head) | ||
| High Production mode [ON] | High production mode [OFF] | |||||
| Max. speed | 42 000 cph (0.086 s/ chip) |
38 000 cph (0.095 s/ chip) |
34 500 cph (0.104 s/ chip) |
21 500 cph (0.167 s/ chip) |
5 500 cph (0.655 s/ chip) 4 250 cph(0.847 s/ QFP) |
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| Placement ccuracy(Cpk1) | ± 40 µm/chip | ±30 μm / chip (±25 μm / chip*5) |
±30 μm / chip | ± 30 µm/chip ± 30 µm/QFP 12mm to 32mm ± 50 µm/QFP 12mm Under |
± 30 µm/QFP | |
| Component dimensions(mm) | 0402 chip*6 to L 6 x W 6 x T 3 | 03015*6*7/0402 chip*6 to L 6 x W 6 x T 3 | 0402 chip*6 to L 12 x W 12 x T 6.5 | 0402 chip*6 to L 32 x W 32 x T 12 | 0603 chip to L 100 x W 90 x T 28 | |
| Component supply |
Taping | Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm | Tape : 4 to 56 / 72 / 88 / 104 mm | |||
| Taping | Max. 68 (4, 8 mm tape, Small reel) | |||||
| Stick | Max.16 (Single stick feeder) | |||||
| Tray | Max.20 (per tray feeder) | |||||
| Dispensing head | Dot dispensing | Draw dispensing |
| Dispensing speed | 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) | 4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*8 |
| Adhesive position accuracy (Cpk1) |
± 75 μ m /dot | ± 100 μ m /component |
| Applicable components | 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP | SOP,PLCC,QFP, Connector, BGA, CSP |
| Inspection head | 2D inspection head (A) | 2D inspection head (B) | |
| Resolution | 18 µm | 9 µm | |
| View size (mm) | 44.4 x 37.2 | 21.1 x 17.6 | |
| Inspection processing time | Solder Inspection *9 | 0.35s/ View size | |
| Component Inspection *9 | 0.5s/ View size | ||
| Inspection object |
Solder Inspection *9 | Chip component : 100 μm x 150 μm or more (0603 mm or more) Package component : φ150 μm or more |
Chip component : 80 μm x 120 μm or more (0402 mm or more) Package component : φ120 μm or more |
| Component Inspection *9 | Square chip (0603 mm or more), SOP, QFP (a pitch of 0.4 mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 | Square chip (0402 mm or more), SOP, QFP (a pitch of 0.3 mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10 | |
| Inspection items |
Solder Inspection *9 | Oozing, blur, misalignment, abnormal shape, bridging | |
| Component Inspection *9 | Missing, shift, flipping, polarity, foreign object inspection *11 | ||
| Inspection position accuracy *12 ( Cpk1) | ± 20 μm | ± 10 μm | |
| No. of inspection |
Solder Inspection *9 | Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine) | |
| Component Inspection *9 | Max. 10 000 pcs./machine | ||
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*1 : |
Due to a difference in PCB transfer reference, a direct connection with NPM (NM-EJM9B) / NPM-W (NM-EJM2D) /NPM-W2 (NM-EJM7D) dual lane specs cannot be established. |
| *2 : | Only for main body |
| *3 : | Dimension D including tray feeder : 2 683 mm Dimension D including feeder cart : 2 728 mm |
| *4 : | Excluding the monitor, signal tower and ceiling fan cover. |
| *5 : | ±25 μm placement support option.(Under conditions specified by Panasonic) |
| *6 : | The 03015/0402 mm chip requires a specific nozzle/feeder. |
| *7 : | Support for 03015 mm chip placement is optional.(Under conditions specified by Panasonic:Placement accuracy ±30 μm / chip ) |
| *8 : | A PCB height measurement time of 0.5s is included. |
| *9 : | One head cannot handle solder inspection and component inspection at the same time. |
| *10 : | Please refer to the specification booklet for details. |
| *11 : | Foreign object is available to chip components. (Excluding 03015 mm chip) |
| *12 : | This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature. |
*Placement tact time, inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.
Panasonic SMT Chip Mounter Npm-D3 Placement Machine was added in Jun 2020
Panasonic SMT Chip Mounter Npm-D3 Placement Machine has been viewed 201 times
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