cLSR3000 Laser Selective Reflow Machine

cLSR3000 Laser Selective Reflow Machine Description:

Laser Selective Reflow

(LSR) uses a uniform defocused laser beam over a specifically tailored area on a PCB with controlled beam intensity to implement novel soldering on specific component(or several components) while not heating up potentially thermally sensitive areas. Laser selective reflow also provides super reliable and fast, only 1~3 seconds laser bonding per selected area, bonding process.

• Bonding accuracy: < ± 5.0µm

• Laser: ~3kW, 1Head

• Power Tunability: 10 ~ 100%

• Beam Size Range: 4 to 45mm

• Beam Shape: Square

• Wave length: IR

• Monitoring: IR camera, Beam profiler, Realtime powermeter

• Footprint: 1.8 x 1.8 meter, 3,000k