FHG08001 Wire to board housing 0.8mm
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FHG08001 Wire to board housing 0.8mm |
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FHG08001 Wire to board housing 0.8mm Description:
| Category | |
| Category | Wire to board housing |
| Circuits | 2-14,16,.20 |
| Pitch | 0.8mm |
| Wafer/Housing | FWF08001,FWF08002 |
| Terminal | / |
| Electrical | |
| Current Rating | 1.0A AC(rms) |
| Temperature Range operating | -25ºC~+85ºC |
| Material and Plating | |
| Material-Metal | Phosphor Bronze |
| Material - Plating Mating | Gold |
| Material - Plating Termination | Gold |
| Material - Resin | PA66 UL94V-0 |
FHG08001 Wire to board housing 0.8mm was added in Feb 2019
FHG08001 Wire to board housing 0.8mm has been viewed 82 times
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