The Encapsulation of COB Ceramic Substrate
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The Encapsulation of COB Ceramic Substrate |
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The Encapsulation of COB Ceramic Substrate Description:
LED，LED封装厂在发布用于于的的的的，cob支架，cob支架，cob一些潜在，cob支架支架的加工加工与与传统传统的的的的的的的的的的的的的的的并正向5W发展。
基础类型：工业生产
材料加工厚度：0.38mm
导电层：铜
金属层厚度：100μm/35μm
表面处理：浸金
金属单面/双面：双面
镀铜通孔：是的
焊锡面膜：是的
The Encapsulation of COB Ceramic Substrate was added in Mar 2018
The Encapsulation of COB Ceramic Substrate has been viewed 615 times
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