Wafer level Jar Packaging

Wafer level Jar Packaging Description:

Silicon wafer-level packaging systems for storing and shipping integrated circuits for the semiconductor industry for 75mm 100mm 150mm 200mm 300mm and even square solar solutions. Plastic packaging jars antistatic and conductive foam liners cushions, and tyvek and carbon leaf interleave separators.  Deep natural color jars and lids use pink anti static foam liners and open cell foam disc separators along with tyvek paper and blackstat discs. Silicon wafer packaging for the electronics semiconductor industry.  Filter paper tyvek discs, carbon leaf, pink foam separators.

Wafer-level jar packaging asemblies

• Silicon Wafer Packaging
• Wafer Jars
• Wafer discs tyvek foam tyvek
• Black conductive carbon separators
• 300mm wafer packaging
• 200mm wafer packaging
• 150mm wafer assembly
• 125mm wafer packing

75mm (3”) 100mm (4”) 125mm (5”) 150mm (6”) 200mm (8”) 300mm (12”) wafers