TGP 110 Thermal Conductive Adhesives

TGP 110 Thermal Conductive Adhesives Description:

Our TGP110 thermal conductive adhesives is a series of reactive thermal grease with very thin BLT that eliminates micro-bubbles at the rough interface when applied. In service time, it can be cured to form thermal gel or thermal pad but with the performance of thermal phase change.

TGP110 has combined the advantages of thermal grease, thermal gel, thermal pad and thermal phase materials while eliminating the disadvantages of these thermal materials. TGP110 has low cost ownership, higher thermal conductivity and excellent reworkability. It has overcome “pump out” of thermal grease, and high cost of thermal gel, thermal pad and phase change materials. Applications of TGP110 include interface materials for LED, laptops, desktops and other high power devices.