V310i Advanced 3D Solder Paste Inspection (SPI) Series

V310i Advanced 3D Solder Paste Inspection (SPI) Series Description:

Designed for paste inspection to increase high throughput productivity in SMT production line.

Our latest innovation in Advanced 3D Solder Paste Inspection (SPI) is designed to specially cater to different sizes of PCB assembly to be examined at a micron level with maximum throughput. This translates to increased production efficiency and cost savings for manufacturers.

Among the key benefits you will experience with our V310i 3D SPI series are:

• High-Speed Performance SPI system in the market
• Powerful reporting for data analysis and performance monitoring
• Smart Manufacturing Ready
• Preferred choice by consumer, automotive, and telecommunication sectors
• Shareable wear & tear spare parts between 3D AOI and 3D SPI under one similar machine
• Competitive Cost of Ownership

V310i 3D SPI Series:

1. V310i Optimus
2. V310i XL
3. V310i XXL
4. V310i SE
5. V310i 3D SPI for Advanced Packaging and Microelectronics