MARCH VIA Series Plasma Treatment

MARCH VIA Series Plasma Treatment Description:

VIA Series plasma treatment systems offer superior plasma treatment uniformity for printed circuit board (PCB) panels. 

The MaxVIA, MaxVIA-Plus, and ModVIA systems deliver various plasma cleaning, surface activation, and adhesion improvement capabilities to suit through-hole and blind VIA applications.

 The VIA Series:

• High Flux Electrode (HFE) design with a temperature-controlled cooling loop delivers superior plasma treatment uniformity for PCB panel, desmear, landing pad cleaning, etchback, and flexible and rigid circuit board applications.
• Low CF4 gas consumption for desmear and etchback applications contributes to the lowest cost of ownership in their class.
• A single space-saving enclosure houses the vacuum system, plasma chamber, control electronics, and power supply.
• The systems accommodate various panel sizes and are ideal for high-volume, low-volume, and high-mixture environments.