Surface Mount Technology companies
Nordson MARCH is the global leader in plasma cleaning equipment and plasma applications technology. The company has designed and manufactured plasma equipment for more than 30 years.
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Nordson MARCH Plasma Treatment Systems
Nordson MARCH is the global leader in plasma cleaning and plasma surface treatment equipment, and plasma applications technology. The company has designed and manufactured plasma surface treatment equipment for more than 30 years and has broad experience in the areas of advanced semiconductor packaging and assembly, wafer level packaging (WLP), printed circuit board manufacturing, life science & medical device assembly, and various large-scale industrial applications.
Nordson MARCH was formed through the merging of March Instruments of Concord, California, USA and Advanced Plasma Systems (APS) of St. Petersburg, Florida, USA. The company was acquired in 1999 by Nordson Corporation and referred to as March Plasma Systems until renamed Nordson MARCH in 2009.
Nordson MARCH headquarters are located in Concord, California, which also houses its product development staff, applications engineering, global technical service support and administrative functions. The company has its principal manufacturing locations in Carlsbad, California. International sales, service and plasma applications staff are located around the world in Maastricht, Netherlands; Tokyo, Japan; Shanghai, China; Hsinchu, Taiwan, and Singapore. Each facility is equipped with equipment for customer-specific applications support.
Plasma treatment prior to conformal coating addresses these detrimental manufacturing issues: Removes organic contaminants Eliminates flux and mold release residue Enhances surface wettabi...
Superior Plasma Process Quality and Automation in One System The Nordson MARCH FlexTRAK™ platform provides unparalleled treatment uniformity and process consistency. A three-axis symmetrical chamber ensures all p...
Nordson MARCH's ModVIA™ system can be upgraded from 4 to 8 plasma cells to grow with production requirements and operations and is ideal for small- to medium-sized businesses or R&D institutions that process low-volume, high-mixture ...
Nov 09, 2016 | Dave Selestak, Alex Berlin, and Carla Loeffler
Nordson MARCH found a solution for a manufacturer of PCBAs used in ruggedized environments. Read how plasma prior to conformal coating reduced defects and virtually eliminated coating-related failures....
Oct 11, 2016 | Nordson MARCH received the 2016 Global Technology Award for its FlexTRAK®-CDS high-volume plasma system at a ceremony held in conjunction with the SMTA International conference in Rosemont, IL on September 27, 2016. The system removes contamination, etches surfaces to improve adhesion, and provides surface activation prior to die attach, wire bond, mold encapsulation, and underfill to lead frame strips, laminated substrates, and other strip-type electronic components.
Sep 21, 2016 | Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.
Mar 03, 2016 | Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at http://bit.ly/MARCH-PlasmaWP.
Aug 20, 2015 | Nordson MARCH announces that its StratoSPHERE™ Series plasma treatment equipment for wafer-level packaging and 3D packaging applications can now be configured in two, four, and even six chamber configurations for increased throughput and flexibility. The SPHERE™ plasma systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out.
Jul 01, 2015 | Nordson MARCH, a Nordson company (NASDAQ: NDSN)announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK™ Series, the new series consists of the TrophoSPHERE™ and StratoSPHERE™ plasma treatment systems. The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Both systems support automated handling and processing of round or square wafers and can process thin wafers with or without a carrier, depending upon the wafer thickness.
Jun 07, 2011 | Nordson MARCH announces the global availability of the MaxVIA™ plasma treatment system that streamlines the printed circuit board (PCB) manufacturing process by quickly and uniformly treating a variety of panel sizes and types.
Jul 16, 2007 | March Plasma Systems has nominated its advanced wafer processing plasma system, the FlexTRAK-WR system, for the prestigious 2007 Editors' Choice Best Product Award sponsored by Semiconductor International magazine.
Apr 23, 2007 | March Plasma Systems has received a firm purchase order for a FlexTRAK-WR wafer processing system from a major semiconductor manufacturing company.