TR7700QE-S - Semiconductor and Advanced Packaging Inspection

Company Information:

Test Research is the World's leading supplier of Test and Inspection Solutions in the PCBA Manufacturing Test & Inspection Industry. From 3D SPI, 3D AOI and 3D AXI Systems to MDA, ICT and Functional Test. Industry 4.0 Ready.

San Jose, California, USA

Manufacturer

408-567-9898
408-567-9288

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Company Postings:

(31) products in the catalog

(47) news releases

Name:	TR7700QE-S - Semiconductor and Advanced Packaging Inspection
Category:	Inspection
Offered by:	TRI - Test Research, Inc. USA

TR7700QE-S - Semiconductor and Advanced Packaging Inspection Description:

The TR7700QE-S is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with metrology capabilities and flexible inspection algorithms.

Features:

Semiconductor and Packaging technology Inspection
Ultra-High Precision Stop-and-Go 3D AOI
Inspection of Wire Bonding and Die Bonding Defects
Ready to Inspect in Minutes with TRI's Smart Programming

TR7700QE-S - Semiconductor and Advanced Packaging Inspection was added in Jul 2022

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