Advanced Techniques US Inc. (ATCO)

Manufacturer of a BGA / QFN / SMT rework stations, reflow soldering equipment, reflow ovens, and smt pick and place machines.

Manufacturer of Assembly Equipment, Pick and Place, Repair/Rework, Soldering

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Fine Pitch Connector Rework with ATCO model AT-GDP Placement & Rework Station.

Advanced Techniques US Inc. (ATCO) designs and manufacturers innovative equipment for assembly, soldering, and rework of printed circuit boards and hybrid microelectronics.  Our product line consists of BGA Rework Stations, Reflow Ovens, and SMT Pick & Place Systems ideal for environments with prototype to medium volumes.

For over 25 years we have built a solid reputation based on delivering quality products that not only perform to specifications but also exceed customer expectations.  ATCO has supplied equipment to some of the world’s largest organizations covering a broad range of industries including; aerospace, consumer electronics, contract electronic manufacturing, government, industrial OEM’s, medical, military, semiconductor, telecommunications, and universities.  More than 4,000 of our products have been installed worldwide.

All of Advanced Techniques US, Inc. (ATCO) products are covered by five (5) years unlimited warranty on parts and labor.

Advanced Techniques US Inc. (ATCO) Postings

7 products »

PRO1600-RS Reflow Simulator

PRO 1600-RS is specifically configured for reflow simulation and thermal stress testing applications. This includes Preconditioning of Nonhermetic Surface Mount Devices (SMD) per JESD22-A113F standard, Moisture Sensitivity Level (MSL) testing of s...

Reflow

PRO1600-RS Reflow Simulator

AT-GDP Series - BGA / QFN / SMT Placement & Rework Stations

The AT-GDP Series BGA Rework Systems are semi-automatic machines featuring the latest vision and process control technologies. Lead-Free applications consisting of complex components such as BGA’s, CSP’s, QFN’s, Flip Chips, and o...

Rework & Repair Equipment

AT-GDP Series - BGA / QFN / SMT Placement & Rework Stations

AT-707 Series BGA Placement & Rework Stations

The AT-707 series BGA Rework Stations are semiautomatic machines featuring spilt vision optics and precise software process control. Systems are used to rework various devices such as BGA’s, CSP’s, QFN’s, QFP’s, and other c...

Rework & Repair Equipment

AT-707 Series BGA Placement & Rework Stations

PRO 1600 - Forced Convection SMT Reflow Oven

PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free ass...

Reflow

PRO 1600 - Forced Convection SMT Reflow Oven

PRO 1600-B Benchtop Convection SMT Reflow Oven

PRO 1600-B is a benchtop full forced air convection reflow oven. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO 1600-B is very flexible in terms of pro...

Reflow

PRO 1600-B Benchtop Convection SMT Reflow Oven

CAT90-M SMT Pick and Place System

CAT90-M is a manual pick and place system featuring the latest high resolution vision technology. The system is designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pitch QFP’s, and many other SM...

Pick & Place

CAT90-M SMT Pick and Place System

CAT90-SA Semi Automatic Pick and Place System

The CAT90-SA pick and place systems are semi-automatic machines featuring software guidance and the latest high resolution vision technology. Systems are designed for placement of various SMT components such as capacitors, resistors, SOIC’s,...

Pick & Place

CAT90-SA Semi Automatic Pick and Place System

1 news release »

New AT-GDP Series BGA Rework Station Provides the Latest Precision and Process Control

Sep 23, 2009 | Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.

Plasma prior Conformal Coating

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