Surface Mount Technology Industry Directory
Surface Mount Technology companies

A pioneering supplier and distributor to the electronics and chemical processing industries.
category: Inspection
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category: Solder Materials
Mixes and softens solder paste in original containers. Improves printing consistency, print quali...
category: Software
The 3D Profiler is an automatic machine to measure the dent of the copper filled vias. The system of...
category: Reflow
Select from Three Standard Types to Suit Work Size and Work Environment: UNIX-412R, UNIX-413R, UNIX...
Published: |
Jan 24, 2013 |
Author: |
Jasbir Bath, Manabu Itoh, Gordon Clark, Hajime Takahashi, Kyosuke Yokota, Kentaro Asai, Atsushi Irisawa, Kimiaki Mori, David Rund, Roberto Garcia |
Abstract: |
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.... |
Christopher Associates to Exhibit the MAGNUS HD TREND at the SMTA Toronto Expo & Tech Forum
Apr 10, 2012 | Christopher Associates Inc. today announced that it will highlight the Tagarno MAGNUS HD TREND at the upcoming SMTA Toronto Expo & Tech Forum,
Christopher Associates to Exhibit the MAGNUS HD TREND at the Del Mar Show
Apr 02, 2012 | Christopher Associates Inc. today announced that it will highlight the Tagarno MAGNUS HD TREND in Booth #346 at the upcoming Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA.
See Christopher Associates’ Award-Winning MAGNUS HD TREND at IMAPS New England
Mar 16, 2012 | Christopher Associates Inc. today announced that it will highlight the Tagarno MAGNUS HD TREND at the upcoming IMAPS NE 39th Symposium & Expo,
Christopher Associates Has the Golden Ticket! Gives “Advertising Grants” at IPC APEX 2012
Mar 13, 2012 |
SANTA ANA, CA — March 2012 ― Industry-leading solutions provider Christopher Associates Inc. made quite the splash with both exhibitors and attendees at the IPC APEX EXPO 2012 in San Diego, CA (2/28-3/1).
Christopher Associates Accepts 2012 NPI Award for the MAGNUS HD TREND from Tagarno
Mar 05, 2012 | Christopher Associates has been awarded a 2012 NPI Award in the category of Rework and Repair Tools for its MAGNUS HD TREND from Tagarno.
Christopher Associates to Introduce Leading-Edge SPI at the 2012 IPC APEX EXPO
Feb 22, 2012 | Christopher Associates Inc. introduces the S-1 solder paste inspection system from MEK. The S-1 represents the leading edge in solder paste inspection technology.
Feb 03, 2012 | Christopher Associates announces that its distributor, TLS Technologies, will display the industry favorite Tagarno Magnus HD Trend at two upcoming SMTA shows.
Jan 30, 2012 | Christopher Associates announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will moderate Session S21, titled “Solder Joint Testing and Performance,” at the upcoming IPC APEX conference and exhibition.
Christopher Associates' Jasbir Bath to Present on Lead-free Alloys at IPC APEX 2012
Jan 26, 2012 | Christopher Associates announces that Jasbir Bath, Consulting Engineer with Christopher Associates/Koki Solder, will present at the IPC APEX EXPO 2012. The presentation, “Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-free Solder Pastes for Electronics Manufacturing,” will take place during Session S16, titled “Lead-free Alloys,”.
Christopher Associates to Unveil New SPI Unit at the 2012 IPC APEX Expo
Jan 21, 2012 | Christopher Associates announced plans to unveil a new SPI unit in Booth #2801 at the upcoming IPC APEX Expo.
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