Nihon Superior Co., Ltd.

Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.

Manufacturer of Assembly Material, Soldering

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. Since then, we have made our mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry.

Backed by our knowledge of these technologies, we have developed into a global company by establishing manufacturing and sales centers in Japan as well as in Asia and Europe, and by forming business partnerships with overseas companies.

We are committed to earning our customers' highest level of trust by taking full responsibility for every product we deliver to them, and we are ready to meet their rising demands for diversification, increasingly sophisticated technologies, and environmental protection. As always, we appreciate your ongoing support of our business endeavors.

SN100C World.

The lead-free solder SN100C is an alloy of tin, copper, nickel and germanium. Its unique properties make it possible to achieve high productivity in soldering processes to produce cost effectively reliable joints. Special features include high fluidity, low copper erosion, low drossing, superior wetting and freedom from shrinkage defects. The number of companies using SN100C has grown dramatically since its first application in 1999 in the soldering of VCR boards.

Nihon Superior Co., Ltd. Postings

6 products »

NS Flux-Cored Lead Solder

We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application. ...</p>
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NS Flux-Cored Lead Solder

eFlux Lead-Free Soldering Flux

eFlux Selection: Rosin Based Flux for Lead-Free Wave Soldering NS-F850. NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum ...

Solder Materials

eFlux Lead-Free Soldering Flux

eBall Lead-Free Solder Spheres

High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge)

Solder Materials

eBall Lead-Free Solder Spheres

ePaste Lead-Free Solder Paste

With its tin-copper-nickel-germanium alloy, SN100C is a popular lead-free wave soldering alloy. Although initially developed to address the need for an economical wave solder, it has since been found that its properties make SN100C ideal for re...

Solder Materials

ePaste Lead-Free Solder Paste

eCore Flux-Cored Lead-Free Solder Wire

In August 2007, Nihon Superior started simultaneous worldwide sales of SN100C (030) “eCore,” a resin flux cored, lead-free solder product, which contains the newly developed flux that enables the product to display the distinctive f...

Solder Materials

eCore Flux-Cored Lead-Free Solder Wire

NS Lead Solder

A rich and line-up of solders possessed of various characteristics and properties. NSH63V forms a strong join and displays excellent resistance to heat cycle stress, thus prolonging the working life of various electrical devices.

Solder Materials

NS Lead Solder

4 technical articles »

Controlling Voiding Mechanisms in the Reflow Soldering Process

Nov 15, 2017 | Keith Sweatman, Takatoshi Nishimura, Kenichiro Sugimoto, Akira Kita

While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process....

Effect of Cooling Rate on the Intermetallic Layer in Solder Joints

Feb 28, 2013 | Keith Sweatman, Tetsuro Nishimura, Stuart D. McDonald, Kazuhiro Nogita

While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two different crystal forms over the temperature range to which electronics circuitry is exposed during assembly and service, it has only recently been recognized that the change from one form to the other has implications for solder joint reliability. (..) In this paper the authors report a study of the effect of cooling rates on Cu6Sn5 crystals. Cooling rates from 200°C ranged from 10°C/minute to 100°C/minute and the effect of isothermal ageing at intermediate temperatures was also studied. The extent of the phase transformation after each regime was determined using synchrotron X-ray diffraction. The findings have important implications for the manufacture of solder joints and their in-service performance... First published in the 2012 IPC APEX EXPO technical conference proceedings.......

Strength of Lead-free BGA Spheres in High Speed Loading

Apr 08, 2008 | Keith Sweatman, Shoichi Suenaga, Tetsuro Nishimura

Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general concern about the resistance of these packages under shock loading has prompted an interest in the impact strength of the soldered BGA connection. This paper reports the results of the measurement of the impact strength of lead-free 0.5±0.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA spheres at high strain rates in shear and tension....

High Reliability Lead-free Solder SN100C?Sn-0.7Cu-0.05Ni?Ge?

Mar 31, 2008 | Satoshi Mizuta

While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C....

135 news releases »

Nihon Superior Solves Industry Challenges with New Solder Pastes – Visit Booth #532 at SMTAI

Aug 15, 2017 | Nihon Superior will exhibit in Booth #532 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Aug 10, 2017 | Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.

Nihon Superior Wins a 2017 NPI Award for the Latest SN100CVTM Lead-Free No-Clean Paste

Feb 16, 2017 | Nihon Superior announces that it has been awarded a 2017 NPI Award in the category of Soldering Materials for its SN100CV P506 D4 Lead-Free Solder Paste. The award was presented to the company’s President, Tetsuro Nishimura during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.

Nihon Superior to Show Solder Pastes that Address Improvements in Reliability and Thermally Stable Joining

Jan 10, 2017 | Nihon Superior will exhibit in Booth #2610 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Aug 30, 2016 | Nihon Superior Co. will exhibit in Booth #418 at SMTA International, scheduled to take place September 27-28, 2016 at Donald Stephens Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Hosts Anniversary Celebration in Japan and Begins Its 50th Year with New Developments

Mar 09, 2016 | Nihon Superior is pleased to announce a great turnout for its 50-year anniversary celebration. The event took place at the Geihinkan Guest House of the Expo ’70 Commemorative Park. The celebration began with a sightseeing tour to Kyoto, followed by the anniversary celebration dinner with cask opening ceremony.

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

Feb 16, 2016 | Nihon Superior will exhibit in Booth #2610 at the IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at NEPCON Japan

Dec 28, 2015 | Nihon Superior will exhibit in East Hall 1 E3-18 at NEPCON Japan, scheduled to take place Jan. 13-15, 2016 at the Tokyo Big Site in Japan. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior to Hold 50th Anniversary Celebration in Japan

Oct 21, 2015 | Nihon Superior Co. is pleased to announce that its 50-year anniversary celebration will take place Oct. 23, 2015 at the Geihinkan Guest House of the Expo ’70 Commemorative Park. The celebration will kick off on Oct. 22 with a sightseeing tour to Kyoto, followed by the anniversary ceremony on Oct. 23, and will conclude with a sightseeing tour to Hyogo prefecture (Kobe) on Oct. 24.

Nihon Superior President Tetsuro Nishimura Recognized as Best Inventor during SMTAI

Oct 11, 2015 | Nihon Superior announces that Tetsuro Nishimura was awarded Best Inventor by SMT Today Magazine during the recent SMTA International Conference & Exhibition. The award was presented to Mr. Nishimura on Tuesday, Sept. 29, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Best Inventor Award recognizes an individual or team whose innovation/s have not only addressed a need and solved a problem but have also been used to drive improved efficiency, productivity and performance within the electronics manufacturing industry.

125 more news releases from Nihon Superior Co., Ltd. »

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