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- Nihon Superior Co., Ltd. 0
Nihon Superior Co., Ltd.
Production and distribution of metal jointing materials for electronics (solder, flux, brazing alloys, etc.). Sales of nonferrous metal
category: Manufacturer of Components
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. Since then, we have made our mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry.
Backed by our knowledge of these technologies, we have developed into a global company by establishing manufacturing and sales centers in Japan as well as in Asia and Europe, and by forming business partnerships with overseas companies.
We are committed to earning our customers' highest level of trust by taking full responsibility for every product we deliver to them, and we are ready to meet their rising demands for diversification, increasingly sophisticated technologies, and environmental protection. As always, we appreciate your ongoing support of our business endeavors.
Nihon Superior Co., Ltd. Postings
Nihon Superior Co., Ltd. has 7 product(s) in the catalog »
category: Solder Materials
SN100C is being used in thousands of wave soldering machines around the world and has proved its ...
A rich and line-up of solders possessed of various characteristics and properties. NSH63V forms a...
category: Solder Materials
Excellent fluidity Bridge-free coating of the fine pitch circuitry Bright smooth ...
We have a wide variety of flux cored solder, a mix of metal alloy, flux and other elements, that we ...
category: Solder Materials
High Perfomance SN100C(551CT) (Sn-Cu-Ni+Ge) Lead-Free Flux-Cored Solder Wire With sustained a...
category: Reflow
High Activity Halogen-Free Solder Paste SN100C P602 is a halogen-free, high-reliability, no-c...
category: Solder Materials
For 01005(0402 metric) Chip Components - SN100C P520 D5 (Sn-Cu-Ni+Ge) High reliability lead-f...
Nihon Superior Co., Ltd. has 3 technical article(s) »
Effect of Cooling Rate on the Intermetallic Layer in Solder Joints
Published: |
Feb 28, 2013 |
Author: |
Keith Sweatman, Tetsuro Nishimura, Stuart D. McDonald, Kazuhiro Nogita |
Abstract: |
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two different crystal forms over the temperature range to which electronics circuitry is exposed during assembly and service, it has only recently been recognized that the change from one form to the other has implications for solder joint reliability. (..) In this paper the authors report a study of the effect of cooling rates on Cu6Sn5 crystals. Cooling rates from 200°C ranged from 10°C/minute to 100°C/minute and the effect of isothermal ageing at intermediate temperatures was also studied. The extent of the phase transformation after each regime was determined using synchrotron X-ray diffraction. The findings have important implications for the manufacture of solder joints and their in-service performance... First published in the 2012 IPC APEX EXPO technical conference proceedings....... |
Strength of Lead-free BGA Spheres in High Speed Loading
Published: |
Apr 08, 2008 |
Author: |
Keith Sweatman, Shoichi Suenaga, Tetsuro Nishimura |
Abstract: |
This paper reports the results of the measurement of the impact strength of lead-free 0.50.01mm diameter BGA spheres on 0.42mm solder mask defined pads on copper/OSP and ENIG substrates using recently developed equipment that can load individual BGA... |
High Reliability Lead-free Solder SN100C?Sn-0.7Cu-0.05Ni?Ge?
Published: |
Mar 31, 2008 |
Author: |
Satoshi Mizuta |
Abstract: |
While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just ... |
Nihon Superior Co., Ltd. has 109 news release(s) »
Nihon Superior Congratulates FCT Assembly and Krayden, Inc. on Milestone Anniversaries
Mar 13, 2013 | Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, congratulates its licensee FCT Assembly (www.fctassembly.com) on its 10-year milestone anniversary being celebrated this year.
Nihon Superior Collects an NPI Award for Its SN100C P604 D4 Solder Paste
Feb 20, 2013 | Nihon Superior Co., Ltd. announces that it was awarded a 2013 NPI Award in the category of Soldering Materials for its SN100C P604 D4 Lead-free and Completely Halogen-Free Solder Paste.
Jan 18, 2013 | Nihon Superior Co. Ltd., will present the paper titled “Grain Refinement for Improved Lead-Free Solder Joint Reliability” at the upcoming IPC APEX EXPO
Nihon Superior to Exhibit Range of Innovative Products at the 2013 IPC APEX EXPO
Jan 16, 2013 | Nihon Superior Co. Ltdwill introduce a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields.
Nihon Superior Scores Its 20th Industry Award with the SN100C P810 D4 Solder Paste
Oct 17, 2012 | Nihon Superior Co., Ltd. announces that it was awarded a 2012 Global Technology Award in the category of Materials – Solder Paste for its SN100C P810 D4 No-Clean Lead-Free Solder Paste.
Nihon Superior’s Keith Sweatman to Present at SMTA International
Sep 17, 2012 | Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012
Nihon Superior to Introduce Ultra Low Voiding Solder Paste at SMTA International 2012
Sep 12, 2012 | Nihon Superior Co. Ltdwill introduce newly developed solder paste for low voiding in soldering processes and materials
Nihon Superior Centre for Manufacture of Electronic Materials at University of Queensland
Aug 01, 2012 | Nihon Superior Co., Ltd. pleased to announce the establishment within the Faculty of Engineering, Architecture and Information Technology of the University of Queensland, Australia of the Nihon Superior Centre for Manufacture of Electronic Materials (NS CMEM).
Nihon Superior to Exhibit at IPCA INTERNATIONAL EXPO 2012
Jul 10, 2012 | Nihon Superior (Singapore) Pte. Ltd.,announces that it will showcase a new, expanded range of products in booth G2 at the upcoming IPCA INTERNATIONAL EXPO 2012, scheduled to take place July 25-27, 2012 in KTPO TRADE CENTRE, WHITEFIELD, in BANGALORE, INDIA.
Nihon Superior to Debut New Low-Voiding Lead-Free Solder Paste
Jun 25, 2012 | Nihon Superior, will introduce a new product, SN100C P810 D4 low-voiding lead-free solder paste, at the upcoming IPCA International Expo, scheduled to take place July 25-27, 2012 at the KTPO Trade Centre in Bangalore, India.
Contact information
Nihon Superior Co., Ltd.
NS Bldg., 1-16-15 Esaka-Cho Suita City
Osaka, 564-0063
Japan
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