American Precision Dicing, Inc.

Semiconductor mfg. services. Precision dicing of hard brittle materials.

Manufacturer

American Precision Dicing, Inc. Postings

3 products »

BioTech Services Division

Our Bio-Tech Services division provides processes on a contract basis to companies engaged in the design and manufacture of various types of microfluidic devices. Our typical client is an R&D group looking for fast turn micro fabrication services...

BioTech Services Division

Laser dicing (Synova Laser Microjet.)

The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p...

Laser dicing (Synova Laser Microjet.)

Precision Wafer Dicing

APD DEVELOPS creative solutions to challenging micro machining problems, using precision diamond dicing blades and lasers to cut and machine a variety of hard brittle materials....

 Precision Wafer Dicing
Reflow Oven

Jade Series Selective Soldering Machines