Process Capabilities (Lead & RoHS

Process Capabilities (Lead & RoHS Description:

• Surface Mount Technology (with BGA's)
• Mixed Technology
• Through-Hole Technology
• Rigid, Rigid Flex, and Flex Circuit assembly
• Testing (functional, manual, troubleshooting), Flying Probe and ICT (outsourced)
• Conformal Coat
• Systems Integration and Box Build Assembly
• Soldering Standard: J-Standard, IPC-A-610 Rev D and NASA 8739 .2 & .3
• Strict adherence to industry standards of ESD control
• Environmental Test Chamber