Printed Circuit Board

Printed Circuit Board Description:

1��Materials��FR-4��CEM-1�� High-Tg170, Teflon, Aluminum-base, Iron-base 2��Layers: Single, Double Side, Multi Layers (Less than 22 Layers) 3��Finished Surface: HAL,Lead Free HAL, Immserion Gold,Plating Flash Gold, O.S.P., Gold-Finger, Carbon Ink, Peelable Mask, BGA. Blind/Buried Via 4��LPI Color��Green��White��Black��Red, Yellow��Semi-Shinny 5��Min Line/Space Outside��4/4mil 6��Min Mechanic Hole��0.20mm