DDF2 and DDF3 Wafer Feeders for Bare-Die/Hybrid Assembly

DDF2 and DDF3 Wafer Feeders for Bare-Die/Hybrid Assembly Description:

Hover-Davis Direct-Die Feeders for wafer-packaged semiconductor and MEMS devices extract and present .7mm up to 11mm die from 100, 150, 200, and 300mm wafers. DDF2 facilitates flexible single-wafer loading while the new DDF3 includes cassette loading of up to 13 wafers with integrated expansion and automatic, touch-less wafer exchange cycling. Both versions include an integrated flipper for flip-chip and die bonding applications, vision detection and server-controlled ALPS electronic wafer bin mapping. The innovative Hover-Davis DDF product line integrates with SMT and special automation systems to avoid the cost and floor space of separate die handling machines.